Primary standard name
Equivalent standard names
Related standards
Chemical composition
Element
Weight %
Comment
Element
Weight %
Comment
Material Information
Certifications
Food Contact: FDA and EU 10/2011, RoHS,REACH
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Processing Tag
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Certification Groups
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Processing methods
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Extrusion, compression molding, coating
Application areas
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Pan-coating, body implants, high temperature capacitors, carriers for printed circuit boards, piston
Optical
Transparency, tr
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no
Mechanical
Impact strength, Charpy notched, Ivnot
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13 - 15 kJ/m² at 23 °C
Hardness, Shore D, HS D
55 [-] at 23 °C
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Elongation, A
50 % at 23 °C
350 - 550 % at 23 °C
Elastic modulus, E
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0.4 - 0.75 GPa at 23 °C
Tensile strength, Rm
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20 - 35 MPa at 23 °C
Impact strength, Charpy unnotched, Iunnot
Yield strength, YS
25 MPa at 23 °C
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General
Density, ρ
2.15 g/cm³ at 23 °C
2.13 - 2.23 g/cm³ at 23 °C
Water absorption, cwater
0.01 % at 23 °C
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Electrical
Loss tangent, 1MHz, tanδ1,MHz
2E-4 [-] at 23 °C
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Volume resistivity, ρel, vol
1.00E+17 Ω·cm at 23 °C
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Dielectric constant, 1MHz, εr,1MHz
2.1 [-] at 23 °C
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Dielectric constant, εr
2.1 [-] at 23 °C
2.1 [-] at 23 °C
Dielectric strength, EDS
48 kV/mm at 23 °C
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Surface resistivity, ρel,surf
1.00E+16 Ω/sq at 23 °C
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Electrical resistivity, ρel
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1.00E+18 Ω·m at 23 °C
Loss tangent, tanδ
2E-4 [-] at 23 °C
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Thermal
Heat deflection temperature, 1.80 MPa, HDT1.8,MPa
55 °C
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Max service temperature, long, Tmaxlong
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260 °C
Thermal conductivity, λ
0.25 W/(m·K) at 23 °C
0.25 W/(m·K) at 23 °C
Coefficient of thermal expansion, α
1.2000000000000002E-4 1/K at 23 °C
1E-4 - 2E-4 1/K at 23 °C
Specific heat capacity, cp
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1000 J/(kg·K) at 23 °C
Max service temperature, short
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300 °C
Flammability
V0 UL 94
UL 94 V0
Max service temperature, Tmax
260 °C
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Heat deflection temperature, 0.45 MPa, HDT0.45,MPa
121 °C
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Melting point, Tm
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325 - 335 °C
Heat deflection temperature, HDT
55 - 121 °C
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