Polyphthalamide (PPA) HT02 GFR 45 BK Q1E501

Alternative und Handelsbezeichungen
PA6T/66-GF45
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Description

Partially Aromatic copolyamide with a combination of semi-crystalline polyamide reinforced with 45% Glass fiber, heat stabilized and lubricated for injection molding process.

Eplamid HT02 grades offer the following unique properties in general conditions, and even after moisture absorption: Good Surface Finish, Good Dimensional Stability, Good High Temperature Properties, Good Chemical Resistance to Glycols and Oils and Excellent Creep Resistance. Eplamid HT02 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

Diese Materialdaten wurden von Epsan zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.56 g/cm³

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ISO 1183

Water content

23.0 °C

0.1 %

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ISO 15512

Mechanisch

PropertyTemperatureValueComment

Dehnung

23.0 °C

2.5 %

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ISO 527-2 (5mm/min)

Elastizitätsmodul

23.0 °C

17.3 GPa

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ISO 527-2 (1mm/min)

Hardness, Ball Indentation

23.0 °C

260 MPa

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ISO 2039-1

Schlagfestigkeit, Charpy gekerbt

-30.0 °C

11 kJ/m²

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ISO 179/1eA

23.0 °C

12 kJ/m²

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ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt

23.0 °C

90 kJ/m²

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ISO 179/1eU

Zugfestigkeit

23.0 °C

235 MPa

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ISO 527-2 (5mm/min)

Thermisch

PropertyTemperatureValueComment

Aschegehalt

23.0 °C

45 %

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ISO 3451-4

Heat deflection temperature, 1.80 MPa

295 °C

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ISO 75-2/A

Heat deflection temperature, 8.0 MPa

150 °C

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ISO 75-2/B

Max. Betriebstemperatur, kurz

250 °C

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ISO 2578

Max. Betriebstemperatur, lang

140 °C

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ISO 2578

Schmelzpunkt

310 °C

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ISO 3146

Entflammbarkeit

UL94 (0.8mm) HB

Elektrisch

PropertyTemperatureValueComment

Durchschlagfestigkeit

23.0 °C

40 kV/mm

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IEC 60243-1

Kriechstromfestigkeit

23.0 °C

600 V

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EN 60112

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.1 %

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ISO 294-4 (3mm)

Schrumpfung, diagonal

23.0 °C

0.6 %

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ISO 294-4 (3mm)

Technological properties

Property
Application areas

Eplamid HT02 grades are used for molding technical parts where higher operating temperatures and higher stiffness in moist environments are required.

Fillers

45% Glass Fiber

Other

Laboratory conditions are 23 ±2°C and 45-55 % RH.