EtchMetᵀᴹ (C17200) TD04 Wire

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Description

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:

It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.

It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.

It has high fatigue strength to withstand many drops and actuation cycles.

It solders and welds readily.

Related Standards

ASTM B250

Diese Materialdaten wurden von Materion Brush GmbH zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
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Eigenschaften

Allgemein

Property	Temperature	Value
Dichte	23.0 °C	8.3 - 8.36 g/cm³ Show Supplier Material materials with Dichte of 8.3 - 8.36 g/cm³

Mechanisch

Property	Temperature	Value	Comment
Dehnung	23.0 °C	1 - 8 % Show Supplier Material materials with Dehnung of 1 - 8 %	for wire with 0.1mm diameter and more.
Elastizitätsmodul	23.0 °C	131 GPa Show Supplier Material materials with Elastizitätsmodul of 131 GPa
Streckgrenze Rp 0,2	23.0 °C	890 - 1110 MPa Show Supplier Material materials with Streckgrenze Rp 0,2 of 890 - 1110 MPa
Zugfestigkeit	23.0 °C	960 - 1140 MPa Show Supplier Material materials with Zugfestigkeit of 960 - 1140 MPa

Thermisch

Property	Temperature	Value
Koeffizient der thermischen Ausdehnung	23.0 °C	1.75E-5 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 1.75E-5 1/K
Wärmeleitfähigkeit	23.0 °C	105 W/(m·K) Show Supplier Material materials with Wärmeleitfähigkeit of 105 W/(m·K)

Elektrisch

Property	Temperature	Value
Specific Electrical conductivity		22 - 28 % IACS Show Supplier Material materials with Specific Electrical conductivity of 22 - 28 % IACS
spezifischer Widerstand	23.0 °C	6.2E-6 - 7.8E-6 Ω·m Show Supplier Material materials with spezifischer Widerstand of 6.2E-6 - 7.8E-6 Ω·m

Magnetisch

Property	Temperature	Value	Comment
Relative magnetische Permeabilität	23.0 °C	1 [-] Show Supplier Material materials with Relative magnetische Permeabilität of 1 [-]	max.

Chemical properties

Property	Value	Comment
Beryllium	1.8 - 2 % Show Supplier Material materials with Beryllium of 1.8 - 2 %
Eisen	0.6 % Show Supplier Material materials with Eisen of 0.6 %	max. Nickel + Cobalt + Iron
Kobalt	0.2 % Show Supplier Material materials with Kobalt of 0.2 %	min. Nickel + Cobalt
Kupfer	Balance
Nickel	0.2 % Show Supplier Material materials with Nickel of 0.2 %	min. Nickel + Cobalt

Technological properties

Property
Application areas	EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.

EtchMetᵀᴹ (C17200) TD04 Wire

Description

Related Standards

Ashby charts

Anwendungen

Materialien von diesem Anbieter

Eigenschaften