EtchMetᵀᴹ (C17200) TD04 Wire

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Description

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:

It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.

It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.

It has high fatigue strength to withstand many drops and actuation cycles.

It solders and welds readily.

Related Standards

ASTM B250

Los datos sobre este material han sido proporcionados por Materion Brush GmbH.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

Property	Temperature	Value
Densidad	23.0 °C	8.3 - 8.36 g/cm³ Show Supplier Material materials with Densidad of 8.3 - 8.36 g/cm³

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	1 - 8 % Show Supplier Material materials with Elongación of 1 - 8 %	for wire with 0.1mm diameter and more.
Límite elástico Rp 0,2	23.0 °C	890 - 1110 MPa Show Supplier Material materials with Límite elástico Rp 0,2 of 890 - 1110 MPa
Módulo elástico	23.0 °C	131 GPa Show Supplier Material materials with Módulo elástico of 131 GPa
Resistencia a la tracción	23.0 °C	960 - 1140 MPa Show Supplier Material materials with Resistencia a la tracción of 960 - 1140 MPa

Aplicaciones térmicas

Property	Temperature	Value
Coeficiente de dilatación térmica	23.0 °C	1.75E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 1.75E-5 1/K
Conductividad térmica	23.0 °C	105 W/(m·K) Show Supplier Material materials with Conductividad térmica of 105 W/(m·K)

Eléctrico

Property	Temperature	Value
Resistividad eléctrica	23.0 °C	6.2E-6 - 7.8E-6 Ω·m Show Supplier Material materials with Resistividad eléctrica of 6.2E-6 - 7.8E-6 Ω·m
Specific Electrical conductivity		22 - 28 % IACS Show Supplier Material materials with Specific Electrical conductivity of 22 - 28 % IACS

Magnético

Property	Temperature	Value	Comment
Permeabilidad magnética relativa	23.0 °C	1 [-] Show Supplier Material materials with Permeabilidad magnética relativa of 1 [-]	max.

Chemical properties

Property	Value	Comment
Berilio	1.8 - 2 % Show Supplier Material materials with Berilio of 1.8 - 2 %
Cobalto	0.2 % Show Supplier Material materials with Cobalto of 0.2 %	min. Nickel + Cobalt
Cobre	Balance
Hierro	0.6 % Show Supplier Material materials with Hierro of 0.6 %	max. Nickel + Cobalt + Iron
Níquel	0.2 % Show Supplier Material materials with Níquel of 0.2 %	min. Nickel + Cobalt

Technological properties

Property
Application areas	EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.

EtchMetᵀᴹ (C17200) TD04 Wire

Description

Related Standards

Ashby charts

Usos

Materiales de este proveedor

Propiedades