General
Property | Temperature | Value |
---|---|---|
Densidad | 23.0 °C | 2.28 g/cm³ Show Supplier Material materials with Densidad of 2.28 g/cm³ |
Mecánica
Property | Temperature | Value |
---|---|---|
Módulo elástico | 23.0 °C | 302 GPa Show Supplier Material materials with Módulo elástico of 302 GPa |
Aplicaciones térmicas
Property | Temperature | Value | Comment |
---|---|---|---|
Calor específico | 23.0 °C | 5890 J/(kg·K) Show Supplier Material materials with Calor específico of 5890 J/(kg·K) | |
Coeficiente de dilatación térmica | 23.0 °C | 8E-6 - 9.5E-6 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 8E-6 - 9.5E-6 1/K | ASTM E228, ASTM E289 |
Conductividad térmica | 23.0 °C | 205 W/(m·K) Show Supplier Material materials with Conductividad térmica of 205 W/(m·K) | |
Difusividad térmica | 23.0 °C | 15.29 mm²/s Show Supplier Material materials with Difusividad térmica of 15.29 mm²/s |
Chemical properties
Property | Value |
---|---|
Berilio | BeO: 49.5-54.8% |
Technological properties
Property | ||
---|---|---|
Application areas | Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices |