General
Property | Temperature | Value | Comment |
---|---|---|---|
Densidad | 23.0 °C | 1.26 g/cm³ Show Supplier Material materials with Densidad of 1.26 g/cm³ | ASTM D 792 |
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 17 % Show Supplier Material materials with Elongación of 17 % | ASTM D 638 | break |
Impact strength, Izod notched, ASTM | 23.0 °C | 128 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 128 J/m | ASTM D 256 |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 1708 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 1708 J/m | ASTM D 4812 | 23°C |
Módulo de flexión | 23.0 °C | 2.1 GPa Show Supplier Material materials with Módulo de flexión of 2.1 GPa | ASTM D 790 |
Resistencia a la flexión | 23.0 °C | 77 MPa Show Supplier Material materials with Resistencia a la flexión of 77 MPa | ASTM D 790 |
Resistencia a la tracción | 23.0 °C | 46 MPa Show Supplier Material materials with Resistencia a la tracción of 46 MPa | ASTM D 638 | yield |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 128 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 128 kJ/m² | ASTM D 256 | notched, 23°C |
Technological properties
Property | ||
---|---|---|
Availability | Asia,Americas | |
Processing methods | Middle - Zone 2 Temperature: 305 to 315.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |