Propiedades
General
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of friction | 0.22 - 0.31 [-] Show Supplier Material materials with Coefficient of friction of 0.22 - 0.31 [-] | ||
Coefficient of friction, kinetic | 0.31 [-] Show Supplier Material materials with Coefficient of friction, kinetic of 0.31 [-] | ASTM D 3702 Modified: Manual | |
Coefficient of friction, static | 0.22 [-] Show Supplier Material materials with Coefficient of friction, static of 0.22 [-] | ASTM D 3702 Modified: Manual | |
Densidad | 23.0 °C | 1.17 g/cm³ Show Supplier Material materials with Densidad of 1.17 g/cm³ | ASTM D 792 |
Moisture absorption | 23.0 °C | 0.18 % Show Supplier Material materials with Moisture absorption of 0.18 % | ISO 62 | (23°C / 50% RH) |
Mecánica
| Property | Temperature | Value | Comment | ||
|---|---|---|---|---|---|
Elongación | 23.0 °C | 5.6 % Show Supplier Material materials with Elongación of 5.6 % | ISO 527 | yield | ||
Impact strength, Izod notched, ASTM | 23.0 °C | 704 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 704 J/m | ASTM D 256 | notched, 23°C | ||
Módulo de flexión | 23.0 °C | 2 GPa Show Supplier Material materials with Módulo de flexión of 2 GPa | ISO 178 | 2 mm/min | ||
Módulo elástico | 23.0 °C | 2.1 GPa Show Supplier Material materials with Módulo elástico of 2.1 GPa | ISO 527 | 1 mm/min | ||
Resistencia a la flexión | 23.0 °C | 78 MPa Show Supplier Material materials with Resistencia a la flexión of 78 MPa | ISO 178 | ||
Resistencia a la tracción | 23.0 °C | 51 MPa Show Supplier Material materials with Resistencia a la tracción of 51 MPa | ISO 527 | yield | ||
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 58 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 58 kJ/m² | ISO 180/1A | 80*10*4, 23°C | ||
Impact strength, Izod unnotched, ASTM | ASTM D 4812 | 23°C | ||||
Aplicaciones térmicas
| Property | Temperature | Value | Comment | ||
|---|---|---|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 7.5E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 7.5E-5 1/K | ASTM D 696 | -30°C to 30°C | ||
Coeficiente de dilatación térmica transversal | 23.0 °C | 7.6E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 7.6E-5 1/K | ASTM D 696 | -30°C to 30°C | ||
Heat deflection temperature, 0.45 MPa | 140 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 140 °C | ISO 75/Bf | Flatw 80*10*4 sp=64mm | |||
Heat deflection temperature, 1.80 MPa | 128 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 128 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm | |||
Relative temperature index, electrical | 80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C | UL 746B | |||
Relative temperature index, mechanical impact | 80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C | UL 746B | |||
Relative temperature index, mechanical strength | 80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C | UL 746B | |||
Temperatura de flexión bajo carga | 128 - 140 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 128 - 140 °C | ||||
Inflamabilidad | UL Recognized, 94HB Flame Class Rating: 1.5mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101283866- - | ||||
Rheological Properties
Technological properties
| Property | ||
|---|---|---|
| Application areas | Electronic Components, Enclosures, Food Processor, Lab Ware and Clinical Diagnostics, Document Handling, Displays, Data Management, Aircraft Seating, Circuit Protection, ATM/Ticket Machine, Amusement Machine, Audio, Auto Aftermarket, Wireless Communications, Wiring Devices, Vacuum Cleaner, Personal Computing, Navigation Unit, Medical Device, Monitoring and Imaging, Refrigerator, Pharmaceutical Packaging & Drug Delivery, Photo/Video Camera, Surgical Devices, Respiratory, Semiconductor | |
| Availability | Asia,Americas | |
| Processing methods | Back Pressure: 0.2 to 0.3MPa | |
| Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. | |