LNP™ STAT-LOY™ Compound 63000CT

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Description

A permanent antistatic PC-Alloy compound that features transparency and superior cleanliness for advanced semiconductor packaging applications

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.16 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.7 %

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ISO 62 | (23°C / 50% RH)

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

140 %

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ISO 527 | break, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

580 J/m

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ASTM D 256 | notched, 23°C

Módulo de flexión

23.0 °C

1.1 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

1.2 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

50 MPa

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ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Resistencia a la tracción

23.0 °C

34 MPa

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ISO 527 | yield, 5 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

69 kJ/m²

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ISO 179/2C | 23°C

Resistencia al choque, ensayo Izod entallado

23.0 °C

580 kJ/m²

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ASTM D 256 | notched, 23°C

Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 0.45 MPa

83 °C

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ASTM D 648 | 6.4 mm, unannealed

Heat deflection temperature, 1.80 MPa

68 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Temperatura de flexión bajo carga

68 - 83 °C

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Eléctrico

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+11 - 5.00E+12 Ω

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ASTM D 257

Volume resistivity

23.0 °C

1.00E+11 - 5.00E+12 Ω·cm

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ASTM D 257

Óptico

PropertyValueComment

Transmission

81 %

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ASTM D 1003 | 2.54 mm

Turbidez

10 %

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ASTM D 1003 | 2.54 mm

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.6 %

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SABIC method

Contracción transversal

23.0 °C

0.6 %

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SABIC method

Velocidad de flujo de la masa derretida

16 g/10min

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ASTM D 1238 | 260°C/2.16 kgf

Technological properties

Property
Application areas

Personal Computing, Semiconductor, Data Management, Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 90 to 95.0°C
Drying Time: 6 to 8.0hrs
Melt Temperature: 230 to 250.0°C
Nozzle Temperature: 230 to 250.0°C
Front - Zone 3 Temperature: 230 to 250.0°C
Middle - Zone 2 Temperature: 225 to 240.0°C
Rear - Zone 1 Temperature: 220 to 230.0°C
Mold Temperature: 40 to 50.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.