ULTEM™ Resin 1010P200 - Europe

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Description

ULTEM™ 1010P200 powder is a RoHS compliant polyetherimide (PEI) powder offering a glass transition temperature (Tg) of 217ºC. This powder has improved flow over 1000P200. The powder has an irregular shape with an average particle size (D50) of 200 micron and a maximum particle size (D100) of 450 micron.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

1.25 %

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ISO 62-1 | (23°C/saturated)

Densidad

23.0 °C

1.27 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.7 %

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ISO 62 | (23°C / 50% RH)

Índice límite de óxigeno

23.0 °C

47 %

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Mecánica

PropertyTemperatureValueComment

Dureza Rockwell M

23.0 °C

109 [-]

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ASTM D 785 |

Elongación

23.0 °C

6 %

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ISO 527 | yield, 50 mm/min

Hardness, Ball Indentation

23.0 °C

140 MPa

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ISO 2039-1 | H358/30

Módulo de flexión

23.0 °C

3.3 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

32 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

160 MPa

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ISO 178 | yield, 2 mm/min

Resistencia a la tracción

23.0 °C

105 MPa

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ISO 527 | yield, 50 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

5 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Taber Abrasion

23.0 °C

10 mg/1000cy

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ASTM D 1044 | CS-17, 1 kg

Resistencia al choque, ensayo Izod no entallado

ISO 180/1U | unnotched 80*10*4, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Coeficiente de dilatación térmica transversal

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Conductividad térmica

23.0 °C

0.24 W/(m·K)

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ISO 8302

Heat deflection temperature, 0.45 MPa

200 °C

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ISO 75/Be | Edgew 120*10*4 sp=100mm

Heat deflection temperature, 1.80 MPa

190 °C

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ISO 75/Ae | Edgew 120*10*4 sp=100mm

Temperatura de flexión bajo carga

190 - 200 °C

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Temperatura de reblandecimiento Vicat

211 °C

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ISO 306 | Rate B/50

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

2.9 [-]

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IEC 60250

Dielectric constant, 60Hz

23.0 °C

2.9 [-]

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IEC 60250 | 50/60 Hz

Dissipation factor, 1MHz

23.0 °C

6E-3 [-]

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IEC 60250

Dissipation factor, 50Hz

23.0 °C

5E-4 [-]

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IEC 60250 | 50/60 Hz

Factor de disipación

23.0 °C

2.5E-3 [-]

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IEC 60250 | 2450 MHz

Rigidez dieléctrica

23.0 °C

16 kV/mm

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IEC 60243-1 | in oil, 3.2 mm,

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 60093 |

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.5 %

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SABIC method | on tensile bar

Velocidad de flujo del volumen derretido

25 cm³/10min

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ISO 1133 | MVR at 360°C/5.0 kg

Technological properties

Property
Application areas

Circuit Board, Composite, Adhesives, Coating

Availability

Europe

Processing methods

Drying Temperature: 150°C
Drying Time: 4 to 6.0hrs
Drying Time (Cumulative): 24hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 350 to 400.0°C
Nozzle Temperature: 345 to 400.0°C
Front - Zone 3 Temperature: 345 to 400.0°C
Middle - Zone 2 Temperature: 340 to 400.0°C
Rear - Zone 1 Temperature: 330 to 400.0°C
Mold Temperature: 135 to 165.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.