General
Property | Temperature | Value | Comment |
---|---|---|---|
Densidad | 23.0 °C | 1.76 g/cm³ Show Supplier Material materials with Densidad of 1.76 g/cm³ | ISO 1183 |
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 1.5 % Show Supplier Material materials with Elongación of 1.5 % | ISO 527 | break, 5 mm/min |
Módulo de flexión | 23.0 °C | 11 GPa Show Supplier Material materials with Módulo de flexión of 11 GPa | ISO 178 | 2 mm/min |
Módulo elástico | 23.0 °C | 12.5 GPa Show Supplier Material materials with Módulo elástico of 12.5 GPa | ISO 527 | 1 mm/min |
Resistencia a la flexión | 23.0 °C | 164 MPa Show Supplier Material materials with Resistencia a la flexión of 164 MPa | ISO 178 | yield, 2 mm/min |
Resistencia a la tracción | 23.0 °C | 102 MPa Show Supplier Material materials with Resistencia a la tracción of 102 MPa | ISO 527 | break, 5 mm/min |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 3 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 3 kJ/m² | ISO 180/1A | notched 80*10*4, 23°C |
Aplicaciones térmicas
Property | Temperature | Value | Comment |
---|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 3.72E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 3.72E-5 1/K | ISO 11359-2 | 23°C to 80°C |
Coeficiente de dilatación térmica transversal | 23.0 °C | 7.34E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 7.34E-5 1/K | ISO 11359-2 | 23°C to 80°C |
Conductividad térmica | 23.0 °C | 1.3 W/(m·K) Show Supplier Material materials with Conductividad térmica of 1.3 W/(m·K) | ISO 22007-2 | ?80*3mm discs |
Heat deflection temperature, 1.80 MPa | 185 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 185 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm | |
Temperatura de flexión bajo carga | 185 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 185 °C | ||
Thermal conductivity, through-plane | 23.0 °C | 0.99 W/(m·K) Show Supplier Material materials with Thermal conductivity, through-plane of 0.99 W/(m·K) | ISO 22007-2 | ?80*3mm discs |
Technological properties
Property | ||
---|---|---|
Application areas | Electronic Components, Wiring Devices, Wireless Communications, LED Lighting, Medical Device, Personal Computing | |
Availability | Asia | |
Processing methods | Back Pressure: 0.2 to 0.3MPa | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |