LNP™ THERMOCOMP™ Compound D10001VI

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Description

LNP THERMOCOMP D10001VI is a colorable, non Chlorinated and non Brominated , UL94 V0@0.8mm, unfilled PC base LDS compound for antenna , or electric circuit manufacturing . Added features of this material include good process-ability , high impact strength , robust flame retardant for thin-wall design, good color-ability.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.3 g/cm³

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ASTM D 792

Densidad relativa

23.0 °C

1.3 [-]

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ASTM D 792

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

50 %

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ISO 527 | break, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

650 J/m

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ASTM D 256

Impact strength, Izod unnotched, ASTM

23.0 °C

2150 J/m

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ASTM D 4812 | 23°C

Módulo de flexión

23.0 °C

2.6 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

2.6 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

90 MPa

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ISO 178 | 2 mm/min

Resistencia a la tracción

23.0 °C

40 MPa

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ISO 527 | break, 5 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

15 kJ/m²

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ISO 179/1eA | V-notch Edgew, 23°C, 80*10*4 sp=62mm

Resistencia al choque, ensayo Izod entallado

23.0 °C

15 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Resistencia al choque, ensayo Izod no entallado

23.0 °C

130 kJ/m²

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ISO 180/1U | unnotched 80*10*4, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

6.4E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coeficiente de dilatación térmica transversal

23.0 °C

7.2E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Heat deflection temperature, 0.45 MPa

117 °C

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ASTM D 648 | 3.2 mm, unannealed

Heat deflection temperature, 1.80 MPa

105 °C

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ASTM D 648 | 3.2mm, unannealed

Temperatura de flexión bajo carga

105 - 117 °C

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Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103685620- - <br> UL Recognized, 94V-0 Flame Class Rating: 0.8mm UL 94

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica

23.0 °C

2.8 [-]

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SABIC method | 20 GHz

Dielectric constant, 10GHz

23.0 °C

2.9 [-]

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SABIC method

Dielectric constant, 1GHz

23.0 °C

3 [-]

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SABIC method | 1.1 GHz

Dielectric constant, 5GHz

23.0 °C

2.9 [-]

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SABIC method

Dissipation factor, 1GHz

23.0 °C

7E-3 [-]

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SABIC method |

Dissipation factor, 5GHz

23.0 °C

7E-3 [-]

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SABIC method

Factor de disipación

23.0 °C

6E-3 [-]

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SABIC method

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.5 %

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ASTM D 955 | 24 hrs

Contracción transversal

23.0 °C

0.5 %

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ASTM D 955 | 24 hrs

Velocidad de flujo del volumen derretido

16 cm³/10min

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ISO 1133 | MVR at 280°C/2.16 kg

Technological properties

Property
Application areas

Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 110 to 120.0°C
Drying Time: 3 to 4.0hrs
Nozzle Temperature: 265 to 290.0°C
Melt Temperature: 270 to 290.0°C
Front - Zone 3 Temperature: 265 to 290.0°C
Middle - Zone 2 Temperature: 265 to 290.0°C
Rear - Zone 1 Temperature: 265 to 290.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.