General
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 8 % Show Supplier Material materials with Elongación of 8 % | SABIC - Japan Method | break |
Hardness, Rockwell R | 23.0 °C | 127 [-] Show Supplier Material materials with Hardness, Rockwell R of 127 [-] | ASTM D 785 |
Impact strength, Izod notched, ASTM | 23.0 °C | 87 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 87 J/m | ASTM D 256 | notched, 23°C |
Módulo de flexión | 23.0 °C | 5.6 GPa Show Supplier Material materials with Módulo de flexión of 5.6 GPa | ASTM D 790 |
Resistencia a la flexión | 23.0 °C | 143 MPa Show Supplier Material materials with Resistencia a la flexión of 143 MPa | ASTM D 790 |
Resistencia a la tracción | 23.0 °C | 107 MPa Show Supplier Material materials with Resistencia a la tracción of 107 MPa | SABIC - Japan Method | yield |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 87 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 87 kJ/m² | ASTM D 256 | notched, 23°C |
Aplicaciones térmicas
Property | Temperature | Value | Comment |
---|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 2.7E-5 - 4.4E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 2.7E-5 - 4.4E-5 1/K | TMA | -30°C to 30°C |
Heat deflection temperature, 1.80 MPa | 143 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 143 °C | ASTM D 648 | 6.4 mm, unannealed | |
Temperatura de flexión bajo carga | 143 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 143 °C |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Contracción | 23.0 °C | 0.2 % Show Supplier Material materials with Contracción of 0.2 % | SABIC method | 3.2 mm |
Velocidad de flujo de la masa derretida | 19.8 g/10min Show Supplier Material materials with Velocidad de flujo de la masa derretida of 19.8 g/10min | ASTM D 1238 | 300°C/5.0 kgf |
Technological properties
Property | ||
---|---|---|
Application areas | Wireless Communications, Monitoring and Imaging, Personal Computing, Power Manangement, Pump, Electronic Components, Enclosure/Housing/Cover, Enclosures, EV Infrastructure, Document Handling, Data Transfer, Data Management, Air Conditioning | |
Availability | Asia | |
Processing methods | Drying Temperature: 110 to 120.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |