LNP™ LUBRICOMP™ Compound EX10405H

Want to keep this datasheet? Save it now in your required format

Description

LNP LUBRICOMP EX10405H is a compound based on Polyetherimide containing proprietary fillers. Added features of this grade include: Wear Resistant, Healthcare.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

Ashby charts

Propiedades

General

PropertyTemperatureValueComment

Coefficient of friction

0.38 - 0.44 [-]

Show Supplier Material materials with Coefficient of friction of 0.38 - 0.44 [-]

Coefficient of friction, kinetic

0.38 [-]

Show Supplier Material materials with Coefficient of friction, kinetic of 0.38 [-]

ASTM D 3702 Modified: Manual

Coefficient of friction, static

0.44 [-]

Show Supplier Material materials with Coefficient of friction, static of 0.44 [-]

ASTM D 3702 Modified: Manual

Densidad relativa

23.0 °C

1.4 [-]

Show Supplier Material materials with Densidad relativa of 1.4 [-]

ASTM D 792

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

1.3 %

Show Supplier Material materials with Elongación of 1.3 %

ASTM D 638 | brk, Type I, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

56 J/m

Show Supplier Material materials with Impact strength, Izod notched, ASTM of 56 J/m

ASTM D 256

Impact strength, Izod unnotched, ASTM

23.0 °C

476 J/m

Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 476 J/m

ASTM D 4812 | 23°C

Módulo de flexión

23.0 °C

17.3 GPa

Show Supplier Material materials with Módulo de flexión of 17.3 GPa

ASTM D 790 | 1.3 mm/min, 50 mm span

Módulo elástico

23.0 °C

21.5 GPa

Show Supplier Material materials with Módulo elástico of 21.5 GPa

ASTM D 638 | 5 mm/min

Resistencia a la flexión

23.0 °C

283 MPa

Show Supplier Material materials with Resistencia a la flexión of 283 MPa

ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Resistencia a la tracción

23.0 °C

216 MPa

Show Supplier Material materials with Resistencia a la tracción of 216 MPa

ASTM D 638 | brk, Type I, 5 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

56 kJ/m²

Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 56 kJ/m²

ASTM D 256 | notched, 23°C

Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 1.80 MPa

213 °C

Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 213 °C

ASTM D 648 | 3.2mm, unannealed

Temperatura de flexión bajo carga

213 °C

Show Supplier Material materials with Temperatura de flexión bajo carga of 213 °C

Technological properties

Property
Application areas

Medical Device, Surgical Devices

Availability

Europe,Asia,Americas

Processing methods

Drying Time: 4 to 6.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 360 to 400.0°C
Front - Zone 3 Temperature: 380 to 400.0°C
Middle - Zone 2 Temperature: 370 to 390.0°C
Rear - Zone 1 Temperature: 360 to 380.0°C
Mold Temperature: 140 to 180.0°C
Back Pressure: 0.3 to 0.7MPa
Drying Temperature: 150°C
Nozzle Temperature: 390 to 400.0°C
Screw speed (Circumferential speed): 0.2 to 0.3m/s
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.