LNP™ STAT-KON™ Compound EE005E - Americas

Want to keep this datasheet? Save it now in your required format

Description

LNP STAT-KON* EE005E is a compound based on Polyetherimide resin containing 25% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

All categories

Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Electrónica

Pantallas

Defensa

Materiales de este proveedor

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

Ver todos los materiales de este proveedor

Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.36 g/cm³ Show Supplier Material materials with Densidad of 1.36 g/cm³	ISO 1183
Moisture absorption	23.0 °C	0.23 % Show Supplier Material materials with Moisture absorption of 0.23 %	ISO 62 \| (23°C / 50% RH)

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	2.1 % Show Supplier Material materials with Elongación of 2.1 %	ISO 527 \| break
Impact strength, Izod notched, ASTM	23.0 °C	53 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 53 J/m	ASTM D 256
Impact strength, Izod unnotched, ASTM	23.0 °C	448 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 448 J/m	ASTM D 4812 \| 23°C
Instrumented Impact, at Peak	23.0 °C	10 J Show Supplier Material materials with Instrumented Impact, at Peak of 10 J	ASTM D 3763 \| 23°C
Módulo de flexión	23.0 °C	15 GPa Show Supplier Material materials with Módulo de flexión of 15 GPa	ISO 178
Módulo elástico	23.0 °C	11.7 GPa Show Supplier Material materials with Módulo elástico of 11.7 GPa	ISO 527 \| 1 mm/min
Resistencia a la flexión	23.0 °C	276 MPa Show Supplier Material materials with Resistencia a la flexión of 276 MPa	ISO 178
Resistencia a la tracción	23.0 °C	200 MPa Show Supplier Material materials with Resistencia a la tracción of 200 MPa	ISO 527 \| break, 5 mm/min
Resistencia al choque, ensayo Izod entallado	23.0 °C	6 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 6 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Resistencia al choque, ensayo Izod no entallado	23.0 °C	29 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 29 kJ/m²	ISO 180/1U \| 80104, 23°C

Aplicaciones térmicas

Property	Temperature	Value	Comment
Coeficiente de dilatación térmica	23.0 °C	1.92E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 1.92E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coeficiente de dilatación térmica transversal	23.0 °C	2.71E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 2.71E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature, 1.80 MPa		207 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 207 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Temperatura de flexión bajo carga		207 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 207 °C

Eléctrico

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	100 - 100000 Ω Show Supplier Material materials with Sheet resistivity, ROA of 100 - 100000 Ω	ASTM D 257
Volume resistivity	23.0 °C	100 - 1000000 Ω·cm Show Supplier Material materials with Volume resistivity of 100 - 1000000 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.1 % Show Supplier Material materials with Contracción of 0.1 %	ISO 294 \| 24 hrs
Contracción transversal	23.0 °C	0.3 % Show Supplier Material materials with Contracción transversal of 0.3 %	ISO 294 \| 24 hrs

Technological properties

Property
Application areas	Individual Equiptment, Data Transfer, Semiconductor
Availability	Asia,Americas
Processing methods	Mold Temperature: 140 to 180.0°C Middle - Zone 2 Temperature: 370 to 390.0°C Drying Time: 4 to 6.0hrs Front - Zone 3 Temperature: 380 to 400.0°C Melt Temperature: 360 to 400.0°C Maximum Moisture Content: 0.02% Back Pressure: 0.3 to 0.7MPa Rear - Zone 1 Temperature: 360 to 380.0°C Drying Temperature: 150°C Nozzle Temperature: 390 to 400.0°C Screw speed (Circumferential speed): 0.2 to 0.3m/s Vent Depth: 0.025 to 0.076mm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.