LNP™ COLORCOMP™ Compound G1000

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Description

LNP COLORCOMP G1000 is an unfilled Polysulfone (PSU) resin. Added feature of this grade is: Transparent.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

0.4 %

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ISO 62-1 | (23°C/24hrs)

Densidad

23.0 °C

1.24 g/cm³

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ISO 1183

Densidad relativa

23.0 °C

1.24 [-]

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ASTM D 792 |

Moisture absorption

23.0 °C

0.3 %

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ASTM D 570 | (23°C/50% RH/24 hrs)

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

5.9 %

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ISO 527 | yield, 50 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

69 J/m

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ASTM D 256

Módulo de flexión

23.0 °C

2.5 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

2.5 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

115 MPa

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ISO 178 | yield, 2 mm/min

Resistencia a la tracción

23.0 °C

60 MPa

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ISO 527 | break, 50 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

6 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Resistencia al choque, ensayo Izod no entallado

ISO 180/1U | unnotched 80*10*4, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

6.1E-5 1/K

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ISO 11359-2 | 23°C to 60°C

Coeficiente de dilatación térmica transversal

23.0 °C

6.2E-5 1/K

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ISO 11359-2 | 23°C to 60°C

Heat deflection temperature, 0.45 MPa

183 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

170 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

160 °C

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UL 746B

Relative temperature index, mechanical impact

140 °C

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UL 746B

Relative temperature index, mechanical strength

160 °C

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UL 746B

Temperatura de flexión bajo carga

170 - 183 °C

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Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=104116794- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥4.5mm UL 94 <br> UL Recognized, 94HB Flame Class Rating: ≥1.5mm UL 94 <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=104098070- -

Eléctrico

PropertyTemperatureValueComment

Dissipation factor, 1MHz

23.0 °C

6E-3 [-]

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ASTM D 150

Dissipation factor, 1kHz

23.0 °C

1E-3 [-]

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ASTM D 150

Dissipation factor, 50Hz

23.0 °C

7E-4 [-]

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ASTM D 150 | 50/60 Hz

High Amp Arc Ignition

23.0 °C

6 mm

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≥, UL 746A | PLC 3

High Volt Arc Track Rate

23.0 °C

4 PLC Code

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UL 746A | (PLC)

Hot-Wire Ignition

23.0 °C

4.5 mm

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≥, UL 746A | PLC 1

Volume resistivity

23.0 °C

3.00E+17 Ω·cm

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ASTM D 257

Índice de seguimiento comparativo

23.0 °C

4 V

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UL 746A | (UL) {PLC}

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.4 %

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SABIC method

Technological properties

Property
Application areas

Medical Device, Surgical Devices

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120 to 150.0°C
Drying Time: 4hrs
Maximum Moisture Content: 0.05%
Melt Temperature: 360 to 370.0°C
Front - Zone 3 Temperature: 350 to 360.0°C
Middle - Zone 2 Temperature: 340 to 350.0°C
Rear - Zone 1 Temperature: 325 to 340.0°C
Mold Temperature: 150°C
Back Pressure: 0.2 to 0.3MPa
Screw Speed: 30 to 60.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.