Propiedades
General
| Property | Temperature | Value | Comment |
|---|---|---|---|
Densidad | 23.0 °C | 1.36 g/cm³ Show Supplier Material materials with Densidad of 1.36 g/cm³ | ASTM D 792 |
Mecánica
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elongación | 23.0 °C | 1.1 % Show Supplier Material materials with Elongación of 1.1 % | ISO 527 | yield, 5 mm/min |
Impact strength, Izod notched, ASTM | 23.0 °C | 67 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 67 J/m | ASTM D 256 | notched, 23°C |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 680 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 680 J/m | ASTM D 4812 | 23°C |
Módulo de flexión | 23.0 °C | 28.8 GPa Show Supplier Material materials with Módulo de flexión of 28.8 GPa | ISO 178 | 2 mm/min |
Resistencia a la flexión | 23.0 °C | 425 MPa Show Supplier Material materials with Resistencia a la flexión of 425 MPa | ISO 178 |
Resistencia a la tracción | 23.0 °C | 293 MPa Show Supplier Material materials with Resistencia a la tracción of 293 MPa | ISO 527 | yield, 5 mm/min |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 7 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 7 kJ/m² | ISO 180/1A | 80*10*4, 23°C |
Technological properties
| Property | ||
|---|---|---|
| Availability | Asia,Americas | |
| Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. | |