LNP™ THERMOCOMP™ Compound DF0061VI

Want to keep this datasheet? Save it now in your required format

Description

LNP Thermocomp DF0061VI compound is a 30% glass fiber reinforced PC resin based LDS material solution with fast plating and stable RF performance. It is non chlorinated/brominated flame retardant. Wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.5 g/cm³

Show Supplier Material materials with Densidad of 1.5 g/cm³

ASTM D 792

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

2 %

Show Supplier Material materials with Elongación of 2 %

ISO 527 | break, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

70 J/m

Show Supplier Material materials with Impact strength, Izod notched, ASTM of 70 J/m

ASTM D 256

Impact strength, Izod unnotched, ASTM

23.0 °C

400 J/m

Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 400 J/m

ASTM D 4812 | 23°C

Módulo de flexión

23.0 °C

8.2 GPa

Show Supplier Material materials with Módulo de flexión of 8.2 GPa

ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

9.3 GPa

Show Supplier Material materials with Módulo elástico of 9.3 GPa

ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

150 MPa

Show Supplier Material materials with Resistencia a la flexión of 150 MPa

ISO 178 | 2 mm/min

Resistencia a la tracción

23.0 °C

106 MPa

Show Supplier Material materials with Resistencia a la tracción of 106 MPa

ISO 527 | break, 5 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

7 kJ/m²

Show Supplier Material materials with Resistencia al choque, ensayo Charpy entallado of 7 kJ/m²

ISO 179/1eA | V-notch Edgew, 23°C, 80*10*4 sp=62mm

Resistencia al choque, ensayo Izod entallado

23.0 °C

7 kJ/m²

Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 7 kJ/m²

ISO 180/1A | notched 80*10*4, 23°C

Resistencia al choque, ensayo Izod no entallado

23.0 °C

30 kJ/m²

Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 30 kJ/m²

ISO 180/1U | unnotched 80*10*4

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

2.1E-5 1/K

Show Supplier Material materials with Coeficiente de dilatación térmica of 2.1E-5 1/K

ISO 11359-2 | -40°C to 40°C

Coeficiente de dilatación térmica transversal

23.0 °C

6.2E-5 1/K

Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 6.2E-5 1/K

ISO 11359-2 | -40°C to 40°C

Heat deflection temperature, 0.45 MPa

118 °C

Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 118 °C

ASTM D 648 | 3.2 mm, unannealed

Heat deflection temperature, 1.80 MPa

115 °C

Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 115 °C

ASTM D 648 | 3.2mm, unannealed

Temperatura de flexión bajo carga

115 - 118 °C

Show Supplier Material materials with Temperatura de flexión bajo carga of 115 - 118 °C

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica

23.0 °C

3.3 [-]

Show Supplier Material materials with Constante dieléctrica of 3.3 [-]

SABIC method | 20 GHz

Dielectric constant, 10GHz

23.0 °C

3.52 [-]

Show Supplier Material materials with Dielectric constant, 10GHz of 3.52 [-]

SABIC method

Dielectric constant, 1GHz

23.0 °C

3.59 [-]

Show Supplier Material materials with Dielectric constant, 1GHz of 3.59 [-]

SABIC method | 1.1 GHz

Dielectric constant, 5GHz

23.0 °C

3.52 [-]

Show Supplier Material materials with Dielectric constant, 5GHz of 3.52 [-]

SABIC method

Dissipation factor, 1GHz

23.0 °C

9E-3 [-]

Show Supplier Material materials with Dissipation factor, 1GHz of 9E-3 [-]

SABIC method |

Dissipation factor, 5GHz

23.0 °C

8E-3 [-]

Show Supplier Material materials with Dissipation factor, 5GHz of 8E-3 [-]

SABIC method

Factor de disipación

23.0 °C

8E-3 [-]

Show Supplier Material materials with Factor de disipación of 8E-3 [-]

SABIC method | 20 GHz

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.1 %

Show Supplier Material materials with Contracción of 0.1 %

SABIC method

Contracción transversal

23.0 °C

0.1 %

Show Supplier Material materials with Contracción transversal of 0.1 %

SABIC method

Velocidad de flujo de la masa derretida

13 g/10min

Show Supplier Material materials with Velocidad de flujo de la masa derretida of 13 g/10min

ASTM D 1238 | 300°C/1.2 kgf

Technological properties

Property
Application areas

Electronic Components, Personal Computing, Wearables, Wireless Communications

Availability

Europe,Asia,Americas

Processing methods

Drying Time: 3 to 4.0hrs
Melt Temperature: 290 to 310.0°C
Nozzle Temperature: 285 to 310.0°C
Front - Zone 3 Temperature: 285 to 310.0°C
Middle - Zone 2 Temperature: 285 to 310.0°C
Rear - Zone 1 Temperature: 285 to 310.0°C
Mold Temperature: 100 to 130.0°C
Back Pressure: 0.1 to 0.3MPa
Screw Speed: 50 to 150.0rpm
Drying Temperature: 110 to 120.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.