LNP™ THERMOCOMP™ Compound UF0067V

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Description

LNP THERMOCOMP UF0067V is PPA base glass fiber filled compounds, good for LDS (Laser direct structuring) applications. Additional feature is high heat such that articles made of it can survive SMT process.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

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Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Ingeniería eléctrica

Electrónica

Pantallas

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Propiedades

General

Property	Temperature	Value	Comment
Absorción de agua	23.0 °C	0.05 % Show Supplier Material materials with Absorción de agua of 0.05 %	ISO 62-1 \| (23°C/24hrs)
Densidad relativa	23.0 °C	1.45 [-] Show Supplier Material materials with Densidad relativa of 1.45 [-]	ASTM D 792

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	1.6 % Show Supplier Material materials with Elongación of 1.6 %	ASTM D 638 \| brk, Type I, 5 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	34 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 34 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	300 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 300 J/m	ASTM D 4812 \| 23°C
Módulo de flexión	23.0 °C	8.5 GPa Show Supplier Material materials with Módulo de flexión of 8.5 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Módulo elástico	23.0 °C	9.5 GPa Show Supplier Material materials with Módulo elástico of 9.5 GPa	ASTM D 638 \| 5 mm/min
Resistencia a la flexión	23.0 °C	150 MPa Show Supplier Material materials with Resistencia a la flexión of 150 MPa	ASTM D 790 \| yld, 1.3 mm/min, 50 mm span
Resistencia a la tracción	23.0 °C	104 MPa Show Supplier Material materials with Resistencia a la tracción of 104 MPa	ASTM D 638 \| brk, Type I, 5 mm/min
Resistencia al choque, ensayo Izod entallado	23.0 °C	34 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 34 kJ/m²	ASTM D 256 \| notched, 23°C

Aplicaciones térmicas

Property	Value	Comment
Heat deflection temperature, 0.45 MPa	276 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 276 °C	ASTM D 648 \| 3.2 mm
Heat deflection temperature, 1.80 MPa	255 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 255 °C	ASTM D 648 \| 1.82 MPa, 3.2 mm
Relative temperature index, electrical	65 °C Show Supplier Material materials with Relative temperature index, electrical of 65 °C	UL 746B
Relative temperature index, mechanical impact	65 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 65 °C	UL 746B
Relative temperature index, mechanical strength	65 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 65 °C	UL 746B
Temperatura de flexión bajo carga	255 - 276 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 255 - 276 °C
Inflamabilidad	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103351790- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.4mm UL 94

Eléctrico

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	3.56 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.56 [-]	SABIC method \| 1.1 GHz
Dissipation factor, 1GHz	23.0 °C	9E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9E-3 [-]	SABIC method \|

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.3 % Show Supplier Material materials with Contracción of 0.3 %	SABIC method
Contracción transversal	23.0 °C	0.5 % Show Supplier Material materials with Contracción transversal of 0.5 %	SABIC method

Technological properties

Property
Application areas	Antenna
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120°C Drying Time: 4 to 7.0hrs Melt Temperature: 290 to 330.0°C Nozzle Temperature: 300 to 320.0°C Front - Zone 3 Temperature: 300 to 320.0°C Middle - Zone 2 Temperature: 280 to 300.0°C Rear - Zone 1 Temperature: 260 to 280.0°C Mold Temperature: 120 to 150.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.