LNP™ STAT-KON™ Compound 9X08403C

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Description

LNP STAT-KON 9X08403C is a compound based on Liquid Crystal Polymer (LCP) resin containing Carbon Fiber. Added features of this material are: Clean Compounding System, High Temperature, Flame Retardant, Electrically Conductive, Good barrier against water and oxygen.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.46 g/cm³

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ASTM D 792

Densidad relativa

23.0 °C

1.46 [-]

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ASTM D 792 |

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

2.7 %

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ASTM D 638 | yld, Type I, 5 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

87 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

826 J/m

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ASTM D 4812 | 23°C

Módulo de flexión

23.0 °C

14.4 GPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Módulo elástico

23.0 °C

14.8 GPa

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ASTM D 638 | 5 mm/min

Resistencia a la flexión

23.0 °C

53 MPa

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ASTM D 790

Resistencia a la tracción

23.0 °C

153 MPa

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ASTM D 638 | yld, Type I, 5 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

87 kJ/m²

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ASTM D 256 | notched, 23°C

Aplicaciones térmicas

PropertyValueComment

Heat deflection temperature, 1.80 MPa

280 °C

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ASTM D 648 | 3.2mm, unannealed

Temperatura de flexión bajo carga

280 °C

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Eléctrico

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+5 - 1.00E+9 Ω

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ASTM D 257

Volume resistivity

23.0 °C

1.00E+5 - 1.00E+9 Ω·cm

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.2 %

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SABIC method

Contracción transversal

23.0 °C

0.52 %

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SABIC method

Technological properties

Property
Application areas

Semiconductor

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120 to 150.0°C
Drying Time: 1 to 3.0hrs
Maximum Moisture Content: 0.01%
Melt Temperature: 330 to 360.0°C
Nozzle Temperature: 330 to 360.0°C
Front - Zone 3 Temperature: 330 to 360.0°C
Middle - Zone 2 Temperature: 330 to 360.0°C
Rear - Zone 1 Temperature: 325 to 360.0°C
Mold Temperature: 65 to 110.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.