LNP™ THERMOCOMP™ Compound UC008H

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Description

LNP THERMOCOMP* UC008H is a compound based on Polyphthalamide resin containing 40% Carbon Fiber. Added features of this material include: Electrically Conductive, Healthcare.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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SABIC

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Usos

Ingeniería eléctrica

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Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.38 g/cm³ Show Supplier Material materials with Densidad of 1.38 g/cm³	ASTM D 792
Moisture absorption	23.0 °C	0.46 % Show Supplier Material materials with Moisture absorption of 0.46 %	ISO 62 \| (23°C / 50% RH)

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	1.3 % Show Supplier Material materials with Elongación of 1.3 %	ISO 527 \| break
Impact strength, Izod notched, ASTM	23.0 °C	58 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 58 J/m	ASTM D 256
Impact strength, Izod unnotched, ASTM	23.0 °C	328 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 328 J/m	ASTM D 4812 \| 23°C
Instrumented Impact, at Peak	23.0 °C	7 J Show Supplier Material materials with Instrumented Impact, at Peak of 7 J	ASTM D 3763 \| 23°C
Módulo de flexión	23.0 °C	26.6 GPa Show Supplier Material materials with Módulo de flexión of 26.6 GPa	ISO 178
Módulo elástico	23.0 °C	35.5 GPa Show Supplier Material materials with Módulo elástico of 35.5 GPa	ISO 527 \| 1 mm/min
Resistencia a la flexión	23.0 °C	425 MPa Show Supplier Material materials with Resistencia a la flexión of 425 MPa	ISO 178
Resistencia a la tracción	23.0 °C	232 MPa Show Supplier Material materials with Resistencia a la tracción of 232 MPa	ISO 527 \| break
Resistencia al choque, ensayo Izod entallado	23.0 °C	7 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 7 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Resistencia al choque, ensayo Izod no entallado	23.0 °C	45 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 45 kJ/m²	ISO 180/1U \| 80104, 23°C

Eléctrico

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	100 - 10000 Ω Show Supplier Material materials with Sheet resistivity, ROA of 100 - 10000 Ω	ASTM D 257
Volume resistivity	23.0 °C	100 - 10000 Ω·cm Show Supplier Material materials with Volume resistivity of 100 - 10000 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.7 % Show Supplier Material materials with Contracción of 0.7 %	ISO 294 \| 24 hrs
Contracción transversal	23.0 °C	0.7 % Show Supplier Material materials with Contracción transversal of 0.7 %	ISO 294 \| 24 hrs

Technological properties

Property
Application areas	Enclosures
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120 to 150.0°C Drying Time: 4hrs Maximum Moisture Content: 0.15% Melt Temperature: 315 to 330.0°C Front - Zone 3 Temperature: 325 to 340.0°C Middle - Zone 2 Temperature: 315 to 325.0°C Rear - Zone 1 Temperature: 310 to 320.0°C Mold Temperature: 140 to 165.0°C Back Pressure: 0.2 to 0.3MPa Screw Speed: 30 to 60.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.