LEXAN™ Copolymer EXL9414 - Asia

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Description

LEXAN EXL9414 polycarbonate (PC) siloxane copolymer resin is a medium flow, non-chlorinated, non-brominated flame retardant opaque injection molding (IM) grade. This resin offers low temperature ductility, thin wall flame retardant capability, and in combination with excellent processability and release with opportunities for shorter IM cycle times compared to standard PC. LEXAN EXL9414 resin is a product available in wide range of opaque colors and may be an excellent candidate for a wide variety of applications, especially the housing of fast-charging mobile phones.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Electrónica

Pantallas

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Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.19 g/cm³ Show Supplier Material materials with Densidad of 1.19 g/cm³	ISO 1183
Densidad relativa	23.0 °C	1.19 [-] Show Supplier Material materials with Densidad relativa of 1.19 [-]	ASTM D 792

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	106 % Show Supplier Material materials with Elongación of 106 %	ISO 527 \| break, 50 mm/min
Hardness, Rockwell L	23.0 °C	83 [-] Show Supplier Material materials with Hardness, Rockwell L of 83 [-]	ASTM D 785
Hardness, Rockwell R	23.0 °C	117 [-] Show Supplier Material materials with Hardness, Rockwell R of 117 [-]	ASTM D 785
Impact strength, Izod notched, ASTM	23.0 °C	660 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 660 J/m	ASTM D 256 \| notched, -30°C
Instrumented Impact, Total Energy	23.0 °C	67 J Show Supplier Material materials with Instrumented Impact, Total Energy of 67 J	ASTM D 3763 \| 23°C
Módulo de flexión	23.0 °C	2.2 GPa Show Supplier Material materials with Módulo de flexión of 2.2 GPa	ISO 178 \| 2 mm/min
Módulo elástico	23.0 °C	2.1 GPa Show Supplier Material materials with Módulo elástico of 2.1 GPa	ISO 527 \| 1 mm/min
Resistencia a la flexión	23.0 °C	86 MPa Show Supplier Material materials with Resistencia a la flexión of 86 MPa	ISO 178 \| yield, 2 mm/min
Resistencia a la tracción	23.0 °C	57 MPa Show Supplier Material materials with Resistencia a la tracción of 57 MPa	ISO 527 \| yield, 50 mm/min
Resistencia al choque, ensayo Charpy entallado	23.0 °C	29 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Charpy entallado of 29 kJ/m²	ISO 179/1eA \| V-notch Edgew 80103 sp=62mm, -30°C
Resistencia al choque, ensayo Izod entallado	23.0 °C	46 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 46 kJ/m²	ISO 180/1A \| notched 80103, -30°C

Aplicaciones térmicas

Property	Temperature	Value	Comment
Coeficiente de dilatación térmica	23.0 °C	7.42E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 7.42E-5 1/K	ISO 11359-2 \| 23°C to 80°C
Coeficiente de dilatación térmica transversal	23.0 °C	7.64E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 7.64E-5 1/K	ISO 11359-2 \| 23°C to 80°C
Heat deflection temperature, 0.45 MPa		131 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 131 °C	ISO 75/Be \| Edgew 120104 sp=100mm
Heat deflection temperature, 1.80 MPa		117 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 117 °C	ISO 75/Ae \| Edgew 120104 sp=100mm
Relative temperature index, electrical		80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C	UL 746B
Relative temperature index, mechanical impact		80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C	UL 746B
Relative temperature index, mechanical strength		80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C	UL 746B
Temperatura de flexión bajo carga		117 - 131 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 117 - 131 °C
Temperatura de reblandecimiento Vicat		138 °C Show Supplier Material materials with Temperatura de reblandecimiento Vicat of 138 °C	ISO 306 \| Rate B/120
Inflamabilidad	Glow Wire Flammability Index 960°C, passes at: 1mm IEC 60695-2-12 <br> Glow Wire Flammability Index 960°C, passes at: 1mm IEC 60695-2-12 <br> UL Recognized, 94-5VB Flame Class Rating: ≥1.5mm UL 94 <br> UL Recognized, 94V-2 Flame Class Rating: ≥0.5mm UL 94 <br> UL Recognized, 94V-2 Flame Class Rating: ≥0.5mm UL 94 <br> UL Recognized, 94-5VA Flame Class Rating: ≥3.1mm UL 94 <br> UL Recognized, 94V-0 Flame Class Rating: ≥1mm UL 94 <br> UL Recognized, 94V-1 Flame Class Rating: ≥0.8mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102896543- -

Eléctrico

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	2.78 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 2.78 [-]	ASTM ES 7-83 \| 1.1 GHz
Dissipation factor, 1GHz	23.0 °C	6E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 6E-3 [-]	ASTM ES 7-83 \| 1.1 GHz
Sheet resistivity, ROA	23.0 °C	1.00E+16 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+16 Ω	>, ASTM D 257
Volume resistivity	23.0 °C	1.00E+16 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+16 Ω·cm	>, ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.4 % Show Supplier Material materials with Contracción of 0.4 %	SABIC method \| 3.2 mm
Contracción transversal	23.0 °C	0.4 % Show Supplier Material materials with Contracción transversal of 0.4 %	SABIC method \| 3.2 mm
Velocidad de flujo de la masa derretida		11.5 g/10min Show Supplier Material materials with Velocidad de flujo de la masa derretida of 11.5 g/10min	ASTM D 1238 \| 300°C/1.2 kgf
Velocidad de flujo del volumen derretido		10 cm³/10min Show Supplier Material materials with Velocidad de flujo del volumen derretido of 10 cm³/10min	ISO 1133 \| MVR at 300°C/1.2 kg

Technological properties

Property
Application areas	Fast Charger, Mobile Phone, Drone, Battery Pack, Power Manangement, Scooter/Moped, Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Front - Zone 3 Temperature: 295 to 315.0°C Back Pressure: 0.3 to 0.7MPa Screw Speed: 40 to 70.0rpm Middle - Zone 2 Temperature: 280 to 305.0°C Drying Time (Cumulative): 48hrs Shot to Cylinder Size: 40 to 60.0% Drying Time: 3 to 4.0hrs Nozzle Temperature: 290 to 310.0°C Rear - Zone 1 Temperature: 270 to 295.0°C Maximum Moisture Content: 0.02% Drying Temperature: 120°C Mold Temperature: 70 to 95.0°C Melt Temperature: 295 to 315.0°C Vent Depth: 0.025 to 0.076mm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.