LNP™ THERMOCOMP™ Compound DX11354

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Description

This is a PC compound with good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Densidad

23.0 °C

1.27 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.01 %

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ASTM D 570 | (23°C/50% RH/24 hrs)

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

64 %

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ASTM D 638 | brk, Type I, 50 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

750 J/m

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ASTM D 256 | notched, 23°C

Módulo de flexión

23.0 °C

2.3 GPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Módulo elástico

23.0 °C

2.6 GPa

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ASTM D 638 | 50 mm/min

Resistencia a la flexión

23.0 °C

91 MPa

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ASTM D 790 | yld, 1.3 mm/min, 50 mm span

Resistencia a la tracción

23.0 °C

52 MPa

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ASTM D 638 | brk, Type I, 50 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

750 kJ/m²

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ASTM D 256 | notched, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

6.3E-5 1/K

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ASTM E 831 | -40°C to 40°C

Coeficiente de dilatación térmica transversal

23.0 °C

6.9E-5 1/K

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ASTM E 831 | -40°C to 40°C

Heat deflection temperature, 1.80 MPa

124 °C

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ASTM D 648 | 3.2mm, unannealed

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Temperatura de flexión bajo carga

124 °C

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Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101230645- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.6mm UL 94

Eléctrico

PropertyTemperatureValueComment

Dielectric constant, 1GHz

23.0 °C

2.92 [-]

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IEC 60250

Dissipation factor, 1GHz

23.0 °C

7E-3 [-]

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IEC 60250

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.6 %

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ASTM D 955 | 24 hrs

Contracción transversal

23.0 °C

0.6 %

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ASTM D 955 | 24 hrs

Velocidad de flujo de la masa derretida

12 g/10min

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ASTM D 1238 | 300°C/1.2 kgf

Technological properties

Property
Application areas

Wireless Communications, Enclosures, Document Handling

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 100 to 110.0°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 8hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 275 to 300.0°C
Nozzle Temperature: 275 to 300.0°C
Front - Zone 3 Temperature: 260 to 300.0°C
Middle - Zone 2 Temperature: 255 to 295.0°C
Rear - Zone 1 Temperature: 250 to 290.0°C
Hopper Temperature: 60 to 80.0°C
Mold Temperature: 60 to 90.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 30 to 80.0%
Vent Depth: 0.038 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.