LNP™ THERMOCOMP™ Compound ZKC08

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Description

LNP™ Thermocomp™ ZKC08 is a compound based on PPO resin containing Mineral Filler, Impact Modifier. Added features of this material include: high dielectric constant (Dk), extremely low dissipation factor (Df), good ductility, and good thermal performance.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

0.03 %

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ISO 62-1 | (23°C/24hrs)

Densidad

23.0 °C

1.43 g/cm³

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ASTM D 792

Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

9.3 %

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ISO 527 | break, 50 mm/min

Impact strength, Izod notched, ASTM

23.0 °C

205 J/m

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ASTM D 256

Módulo de flexión

23.0 °C

2.2 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

2.1 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

72 MPa

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ISO 178 | yield, 2 mm/min

Resistencia a la tracción

23.0 °C

42 MPa

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ISO 527 | break, 50 mm/min

Resistencia al choque, ensayo Izod entallado

23.0 °C

21 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Coeficiente de dilatación térmica

23.0 °C

6.1E-5 1/K

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ASTM E 831 | -40°C to 150°C

Coeficiente de dilatación térmica transversal

23.0 °C

8.3E-5 1/K

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ASTM E 831 | -40°C to 150°C

Heat deflection temperature, 0.45 MPa

174 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

149 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

65 °C

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UL 746B

Relative temperature index, mechanical impact

65 °C

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UL 746B

Relative temperature index, mechanical strength

65 °C

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UL 746B

Temperatura de flexión bajo carga

149 - 174 °C

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Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102468956- - <br> UL Recognized, 94HB Flame Class Rating: 1mm UL 94

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica

23.0 °C

3.93 [-]

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SABIC method | 1.9 GHz

Dielectric constant, 10GHz

23.0 °C

3.93 [-]

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SABIC method

Dielectric constant, 1GHz

23.0 °C

3.91 [-]

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SABIC method | 1.1 GHz

Dielectric constant, 5GHz

23.0 °C

3.95 [-]

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SABIC method

Dissipation factor, 1GHz

23.0 °C

9E-4 [-]

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SABIC method |

Dissipation factor, 5GHz

23.0 °C

1.8E-3 [-]

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SABIC method

Factor de disipación

23.0 °C

1.2E-3 [-]

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SABIC method

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.75 %

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ASTM D 955 | 24 hrs

Contracción transversal

23.0 °C

0.75 %

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ASTM D 955 | 24 hrs

Velocidad de flujo de la masa derretida

31 g/10min

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ASTM D 1238 | 300°C/10 kgf

Velocidad de flujo del volumen derretido

7 cm³/10min

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ISO 1133 | MVR at 300°C/5.0 kg

Technological properties

Property
Application areas

Wireless Communications

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 105°C
Drying Time: 3 to 5.0hrs
Melt Temperature: 285 to 295.0°C
Nozzle Temperature: 280 to 295.0°C
Front - Zone 3 Temperature: 285 to 305.0°C
Middle - Zone 2 Temperature: 280 to 295.0°C
Rear - Zone 1 Temperature: 275 to 285.0°C
Mold Temperature: 90°C
Back Pressure: 9MPa
Screw Speed: 100rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.