General
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 10 % Show Supplier Material materials with Elongación of 10 % | ISO 527 | break, 5 mm/min |
Impact strength, Izod notched, ASTM | 23.0 °C | 115 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 115 J/m | ASTM D 256 |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 1800 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 1800 J/m | ASTM D 4812 | 23°C |
Módulo de flexión | 23.0 °C | 2.4 GPa Show Supplier Material materials with Módulo de flexión of 2.4 GPa | ISO 178 | 2 mm/min |
Módulo elástico | 23.0 °C | 2.3 GPa Show Supplier Material materials with Módulo elástico of 2.3 GPa | ISO 527 | 1 mm/min |
Resistencia a la flexión | 23.0 °C | 87 MPa Show Supplier Material materials with Resistencia a la flexión of 87 MPa | ISO 178 | yield, 2 mm/min |
Resistencia a la tracción | 23.0 °C | 53 MPa Show Supplier Material materials with Resistencia a la tracción of 53 MPa | ISO 527 | break, 5 mm/min |
Resistencia al choque, ensayo Charpy entallado | 23.0 °C | 9 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Charpy entallado of 9 kJ/m² | ISO 179/1eA | V-notch Edgew 80*10*4 sp=62mm, 23°C |
Resistencia al choque, ensayo Charpy no entallado | 23.0 °C | 92 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Charpy no entallado of 92 kJ/m² | ISO 179/2C | 23°C |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 10 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 10 kJ/m² | ISO 180/1A | notched 80*10*4, 23°C |
Resistencia al choque, ensayo Izod no entallado | 23.0 °C | 90 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 90 kJ/m² | ISO 180/1U | 80*10*4, 23°C |
Aplicaciones térmicas
Property | Value | Comment | |
---|---|---|---|
Heat deflection temperature, 0.45 MPa | 138 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 138 °C | ASTM D 648 | 3.2 mm, unannealed | |
Heat deflection temperature, 1.80 MPa | 125 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 125 °C | ASTM D 648 | 3.2mm, unannealed | |
Relative temperature index, electrical | 80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C | UL 746B | |
Relative temperature index, mechanical impact | 80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C | UL 746B | |
Relative temperature index, mechanical strength | 80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C | UL 746B | |
Temperatura de flexión bajo carga | 125 - 138 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 125 - 138 °C | ||
Inflamabilidad | UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101260651- - <br> UL Recognized, 94HB Flame Class Rating: ≥1mm UL 94 |
Eléctrico
Property | Temperature | Value | Comment |
---|---|---|---|
Sheet resistivity, ROA | 23.0 °C | 1.00E+5 - 1.00E+9 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+5 - 1.00E+9 Ω | ASTM D 257 |
Rheological Properties
Technological properties
Property | ||
---|---|---|
Application areas | Enclosure/Housing/Cover, Semiconductor, LED Lighting | |
Availability | Europe,Asia,Americas | |
Processing methods | Drying Temperature: 120°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |