LNP™ THERMOCOMP™ Compound RX10405H

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Description

LNP THERMOCOMP RX10405H is a compound based on Nylon 66 resin containing Carbon Fiber. Added feature of this material is: Healthcare.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Healthcare

Equipos médicos

Instrumental quirúrgico

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Propiedades

General

Property	Temperature	Value	Comment
Densidad relativa	23.0 °C	1.33 [-] Show Supplier Material materials with Densidad relativa of 1.33 [-]	ASTM D 792

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	1.6 % Show Supplier Material materials with Elongación of 1.6 %	ASTM D 638 \| brk, Type I, 5 mm/min
Impact strength, Izod notched, ASTM	23.0 °C	101 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 101 J/m	ASTM D 256 \| notched, 23°C
Módulo de flexión	23.0 °C	24.4 GPa Show Supplier Material materials with Módulo de flexión of 24.4 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Módulo elástico	23.0 °C	31 GPa Show Supplier Material materials with Módulo elástico of 31 GPa	ASTM D 638 \| 5 mm/min
Resistencia a la flexión	23.0 °C	386 MPa Show Supplier Material materials with Resistencia a la flexión of 386 MPa	ASTM D 790 \| brk, 1.3 mm/min, 50 mm span
Resistencia a la tracción	23.0 °C	276 MPa Show Supplier Material materials with Resistencia a la tracción of 276 MPa	ASTM D 638 \| brk, Type I, 5 mm/min
Resistencia al choque, ensayo Izod entallado	23.0 °C	101 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 101 kJ/m²	ASTM D 256 \| notched, 23°C

Aplicaciones térmicas

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	256 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 256 °C	ASTM D 648 \| 3.2mm, unannealed
Temperatura de flexión bajo carga	256 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 256 °C

Eléctrico

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	100 Ω Show Supplier Material materials with Sheet resistivity, ROA of 100 Ω	ASTM D 257

Technological properties

Property
Application areas	Oil/Gas, Surgical Devices
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 80°C Drying Time: 4hrs Maximum Moisture Content: 0.15 to 0.25% Melt Temperature: 280 to 305.0°C Front - Zone 3 Temperature: 295 to 305.0°C Middle - Zone 2 Temperature: 280 to 295.0°C Rear - Zone 1 Temperature: 265 to 275.0°C Mold Temperature: 95 to 110.0°C Back Pressure: 0.2 to 0.3MPa Screw Speed: 30 to 60.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.