LNP™ THERMOCOMP™ Compound RZ006

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Description

LNP THERMOCOMP* RZ006 is a compound based on Nylon 66 resin containing 30% Milled Glass.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Ingeniería eléctrica

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Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.39 g/cm³ Show Supplier Material materials with Densidad of 1.39 g/cm³	ASTM D 792

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	4.3 % Show Supplier Material materials with Elongación of 4.3 %	ASTM D 638 \| break
Impact strength, Izod notched, ASTM	23.0 °C	32 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 32 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	320 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 320 J/m	ASTM D 4812 \| 23°C
Módulo de flexión	23.0 °C	4.3 GPa Show Supplier Material materials with Módulo de flexión of 4.3 GPa	ASTM D 790
Resistencia a la flexión	23.0 °C	119 MPa Show Supplier Material materials with Resistencia a la flexión of 119 MPa	ASTM D 790
Resistencia a la tracción	23.0 °C	68 MPa Show Supplier Material materials with Resistencia a la tracción of 68 MPa	ASTM D 638 \| break
Resistencia al choque, ensayo Izod entallado	23.0 °C	32 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 32 kJ/m²	ASTM D 256 \| notched, 23°C

Aplicaciones térmicas

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	115 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 115 °C	ASTM D 648 \| 3.2mm, unannealed
Temperatura de flexión bajo carga	115 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 115 °C

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	1.4 % Show Supplier Material materials with Contracción of 1.4 %	ASTM D 955 \| 24 hrs
Contracción transversal	23.0 °C	1.5 % Show Supplier Material materials with Contracción transversal of 1.5 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Electronic Components
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 80°C Drying Time: 4hrs Maximum Moisture Content: 0.15 to 0.25% Melt Temperature: 280 to 305.0°C Front - Zone 3 Temperature: 295 to 305.0°C Middle - Zone 2 Temperature: 280 to 295.0°C Rear - Zone 1 Temperature: 265 to 275.0°C Mold Temperature: 95 to 110.0°C Back Pressure: 0.2 to 0.3MPa Screw Speed: 30 to 60.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.