General
Property | Temperature | Value | Comment |
---|---|---|---|
Absorción de agua | 23.0 °C | 0.2 % Show Supplier Material materials with Absorción de agua of 0.2 % | ISO 62-1 | (23°C/24hrs) |
Densidad | 23.0 °C | 1.44 g/cm³ Show Supplier Material materials with Densidad of 1.44 g/cm³ | ISO 1183 |
Densidad relativa | 23.0 °C | 1.44 [-] Show Supplier Material materials with Densidad relativa of 1.44 [-] | ASTM D 792 | |
Moisture absorption | 23.0 °C | 0.07 % Show Supplier Material materials with Moisture absorption of 0.07 % | 23°C/50% |
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 3 % Show Supplier Material materials with Elongación of 3 % | ISO 527 | break, 5 mm/min |
Impact strength, Izod notched, ASTM | 23.0 °C | 89 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 89 J/m | ASTM D 256 |
Módulo de flexión | 23.0 °C | 7.2 GPa Show Supplier Material materials with Módulo de flexión of 7.2 GPa | ISO 178 | 2 mm/min |
Módulo elástico | 23.0 °C | 8.9 GPa Show Supplier Material materials with Módulo elástico of 8.9 GPa | ASTM D 638 | 5 mm/min |
Resistencia a la flexión | 23.0 °C | 197 MPa Show Supplier Material materials with Resistencia a la flexión of 197 MPa | ASTM D 790 | yld, 1.3 mm/min, 50 mm span |
Resistencia a la tracción | 23.0 °C | 157 MPa Show Supplier Material materials with Resistencia a la tracción of 157 MPa | ISO 527 | break, 5 mm/min |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 9 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 9 kJ/m² | ISO 180/1A | notched 80*10*4, 23°C |
Aplicaciones térmicas
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coeficiente de dilatación térmica | 23.0 °C | 1.8E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 1.8E-5 1/K | ISO 11359-2 | 23°C to 150°C | ||
Coeficiente de dilatación térmica transversal | 23.0 °C | 5.9E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica transversal of 5.9E-5 1/K | ISO 11359-2 | 23°C to 150°C | ||
Heat deflection temperature, 1.80 MPa | 208 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 208 °C | ISO 75/Ae | Edgew 120*10*4 sp=100mm | |||
Temperatura de flexión bajo carga | 208 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 208 °C | ||||
Inflamabilidad | UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=100116343- - |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Contracción | 23.0 °C | 0.46 % Show Supplier Material materials with Contracción of 0.46 % | SABIC method |
Contracción transversal | 23.0 °C | 0.54 % Show Supplier Material materials with Contracción transversal of 0.54 % | SABIC method |
Velocidad de flujo de la masa derretida | 19.7 g/10min Show Supplier Material materials with Velocidad de flujo de la masa derretida of 19.7 g/10min | ASTM D 1238 | 337°C/6.6 kgf | |
Velocidad de flujo del volumen derretido | 40 cm³/10min Show Supplier Material materials with Velocidad de flujo del volumen derretido of 40 cm³/10min | ISO 1133 | MVR at 345°C/10.0 kg |
Technological properties
Property | ||
---|---|---|
Application areas | Photo/Video Camera, Semiconductor, Electronic Components, Circuit Protection, Additive Semiconductor Materials | |
Availability | Europe,Asia,Americas | |
Processing methods | Middle - Zone 2 Temperature: 340 to 400.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |