LNP™ THERMOCOMP™ Compound JF006 - Europe

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Description

LNP THERMOCOMP JF006 is a compound based on Polyethersulfone resin containing 30% Glass Fiber.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Construcción

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Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.58 g/cm³ Show Supplier Material materials with Densidad of 1.58 g/cm³	ISO 1183

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	2 % Show Supplier Material materials with Elongación of 2 %	ISO 527 \| break, 5 mm/min
Módulo de flexión	23.0 °C	10 GPa Show Supplier Material materials with Módulo de flexión of 10 GPa	ISO 178
Resistencia a la flexión	23.0 °C	207 MPa Show Supplier Material materials with Resistencia a la flexión of 207 MPa	ISO 178
Resistencia a la tracción	23.0 °C	142 MPa Show Supplier Material materials with Resistencia a la tracción of 142 MPa	ISO 527 \| break, 5 mm/min
Resistencia al choque, ensayo Izod entallado	23.0 °C	9 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 9 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Resistencia al choque, ensayo Izod no entallado	23.0 °C	40 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 40 kJ/m²	ISO 180/1U \| unnotched 80104, 23°C

Aplicaciones térmicas

Property	Temperature	Value	Comment
Coeficiente de dilatación térmica	23.0 °C	3E-5 1/K Show Supplier Material materials with Coeficiente de dilatación térmica of 3E-5 1/K	ISO 11359-2 \| 23°C to 60°C
Heat deflection temperature, 1.80 MPa		210 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 210 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Temperatura de flexión bajo carga		210 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 210 °C
Inflamabilidad	UL Recognized, 94V-0 Flame Class Rating: 0.5mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101282591- -

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.2 % Show Supplier Material materials with Contracción of 0.2 %	SABIC method \| on tensile bar

Technological properties

Property
Application areas	Medical Device
Availability	Europe,Americas
Processing methods	Melt Temperature: 355 to 370.0°C Front - Zone 3 Temperature: 370 to 380.0°C Middle - Zone 2 Temperature: 360 to 370.0°C Drying Temperature: 120 to 150.0°C Screw Speed: 60 to 100.0rpm Drying Time: 4hrs Mold Temperature: 140 to 150.0°C Maximum Moisture Content: 0.05% Rear - Zone 1 Temperature: 345 to 355.0°C Back Pressure: 0.3 to 0.7MPa
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.