LEXAN™ Copolymer EXL1434 - Asia

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Description

LEXAN EXL1434 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade and is UV stabilized. This resin offers extreme low temperature (-40 C), exhibits excellent processability and release with opportunities for shorter IM cycle times compared to standard PC. LEXAN EXL1434 resin is a product available in wide range of opaque colors and may be an excellent candidate for a wide variety of applications.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValueComment

Absorción de agua

23.0 °C

0.35 %

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ISO 62-1 | (23°C/saturated)

Densidad

23.0 °C

1.19 g/cm³

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ISO 1183

Densidad relativa

23.0 °C

1.18 [-]

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ASTM D 792 |

Moisture absorption

23.0 °C

0.15 %

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ISO 62 | (23°C / 50% RH)

Índice límite de óxigeno

23.0 °C

37 %

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Mecánica

PropertyTemperatureValueComment

Elongación

23.0 °C

120 %

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ISO 527 | break, 50 mm/min

Hardness, Rockwell L

23.0 °C

89 [-]

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ASTM D 785

Hardness, Rockwell R

23.0 °C

121 [-]

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ASTM D 785

Impact strength, Izod notched, ASTM

23.0 °C

774 J/m

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ASTM D 256

Instrumented Impact, Total Energy

23.0 °C

70 J

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ASTM D 3763 | 23°C

Módulo de flexión

23.0 °C

2.3 GPa

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ISO 178 | 2 mm/min

Módulo elástico

23.0 °C

2.2 GPa

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ISO 527 | 1 mm/min

Resistencia a la flexión

23.0 °C

85 MPa

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ISO 178 | yield, 2 mm/min

Resistencia a la tracción

23.0 °C

57 MPa

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ISO 527 | yield, 50 mm/min

Resistencia al choque, ensayo Charpy entallado

23.0 °C

70 kJ/m²

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ISO 179/1eA | V-notch Edgew 80*10*3 sp=62mm, 23°C

Resistencia al choque, ensayo Izod entallado

23.0 °C

70 kJ/m²

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ISO 180/1A | 80*10*3, 23°C

Resistencia al choque, ensayo Charpy no entallado

ISO 179/1eU | Unnotch Edgew 80*10*3 sp=62mm, 23°C

Resistencia al choque, ensayo Izod no entallado

ISO 180/1U | 80*10*3, -30°C

Aplicaciones térmicas

PropertyTemperatureValueComment

Ball Pressure Test

Passes

IEC 60695-10-2 | 125°C +/- 2°C

Coeficiente de dilatación térmica

23.0 °C

7.2E-5 1/K

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ISO 11359-2 | 23°C to 80°C

Coeficiente de dilatación térmica transversal

23.0 °C

7.2E-5 1/K

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ISO 11359-2 | 23°C to 80°C

Glow Wire Flammability Index

960 °C

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Glow Wire Ignition Temperature

875 °C

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IEC 60695-2-13 | 0.8 mm

Heat deflection temperature, 0.45 MPa

140 °C

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ISO 75/Be | Edgew 120*10*4 sp=100mm

Heat deflection temperature, 1.80 MPa

128 °C

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ISO 75/Ae | Edgew 120*10*4 sp=100mm

Relative temperature index, electrical

130 °C

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UL 746B

Relative temperature index, mechanical impact

120 °C

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UL 746B

Relative temperature index, mechanical strength

130 °C

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UL 746B

Temperatura de flexión bajo carga

128 - 140 °C

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Temperatura de reblandecimiento Vicat

145 °C

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ISO 306 | Rate B/50

Inflamabilidad

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=100079886- - <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=514823- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.7mm UL 94 <br> Glow Wire Ignitability Temperature, 1.0 mm: 875°C IEC 60695-2-13 <br> Glow Wire Ignitability Temperature, 1.5 mm: 875°C IEC 60695-2-13 <br> Glow Wire Flammability Index, 1.5 mm: 960°C IEC 60695-2-12 <br> Glow Wire Flammability Index, 1.0 mm: 960°C IEC 60695-2-12 <br> Glow Wire Flammability Index, 0.8 mm: 850°C IEC 60695-2-12 <br> UV-light, water exposure/immersion: F1- UL 746C

Eléctrico

PropertyTemperatureValueComment

Constante dieléctrica, 1 MHz

23.0 °C

2.64 [-]

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ASTM D 150

Constante dieléctrica, 100 Hz

23.0 °C

2.68 [-]

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ASTM D 150

Dissipation factor, 100Hz

23.0 °C

1.2E-3 [-]

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ASTM D 150

Dissipation factor, 1MHz

23.0 °C

9.3E-3 [-]

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ASTM D 150

High Amp Arc Ignition

23.0 °C

0.7 mm

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≥, UL 746A | PLC 1

Hot-Wire Ignition

23.0 °C

0.7 mm

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≥, UL 746A | PLC 0

Rigidez dieléctrica

23.0 °C

16.2 kV/mm

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ASTM D 149 | in oil, 0.8 mm

Sheet resistivity, ROA

23.0 °C

1.00E+15 Ω

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>, ASTM D 257

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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>, ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Contracción

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Contracción transversal

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Velocidad de flujo de la masa derretida

10 g/10min

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ASTM D 1238 | 300°C/1.2 kgf

Velocidad de flujo del volumen derretido

9 cm³/10min

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ISO 1133 | MVR at 300°C/1.2 kg

Technological properties

Property
Application areas

Wireless Communications, Wearables, Wiring Devices, Vacuum Cleaner, Washing Machine, Rail, Small Appliance, Surgical Devices, Power Manangement, LED Lighting, Non-LED Lighting, Personal Computing, Enclosures, Enclosure/Housing/Cover, Energy Management, Electronics, Heavy Vehicles, Displays, Data Transfer, Audio, Air Conditioning

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 48hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 295 to 315.0°C
Nozzle Temperature: 290 to 310.0°C
Front - Zone 3 Temperature: 295 to 315.0°C
Middle - Zone 2 Temperature: 280 to 305.0°C
Rear - Zone 1 Temperature: 270 to 295.0°C
Mold Temperature: 70 to 95.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.