General
Property | Temperature | Value | Comment |
---|---|---|---|
Densidad | 23.0 °C | 1.33 g/cm³ Show Supplier Material materials with Densidad of 1.33 g/cm³ | ISO 1183 |
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Módulo de flexión | 23.0 °C | 6.9 GPa Show Supplier Material materials with Módulo de flexión of 6.9 GPa | ISO 178 | 2 mm/min |
Resistencia a la flexión | 23.0 °C | 138 MPa Show Supplier Material materials with Resistencia a la flexión of 138 MPa | ISO 178 | yield, 2 mm/min |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 8 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 8 kJ/m² | ISO 180/1A | 80*10*4, 23°C |
Aplicaciones térmicas
Property | Value | Comment |
---|---|---|
Heat deflection temperature, 1.80 MPa | 132 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 132 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm |
Temperatura de flexión bajo carga | 132 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 132 °C |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Contracción | 23.0 °C | 0.23 % Show Supplier Material materials with Contracción of 0.23 % | SABIC method |
Technological properties
Property | ||
---|---|---|
Availability | Europe,Asia,Americas | |
Processing methods | Melt Temperature: 300 to 305.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |