LNP™ THERMOTUF™ Compound WF003I - Americas

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Description

LNP THERMOTUF* WF003I is a compound based on PBT resin containing 15% Glass Fiber. Added features of this material include: High Impact.

Los datos sobre este material han sido proporcionados por Sabic.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Usos

Ingeniería eléctrica

Automotriz

Piezas generales para vehículos

Exterior automotriz

Automotive Interior

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Propiedades

General

Property	Temperature	Value	Comment
Densidad	23.0 °C	1.37 g/cm³ Show Supplier Material materials with Densidad of 1.37 g/cm³	ISO 1183

Mecánica

Property	Temperature	Value	Comment
Elongación	23.0 °C	3 % Show Supplier Material materials with Elongación of 3 %	ISO 527 \| yield
Módulo de flexión	23.0 °C	4.4 GPa Show Supplier Material materials with Módulo de flexión of 4.4 GPa	ISO 178 \| 2 mm/min
Módulo elástico	23.0 °C	5 GPa Show Supplier Material materials with Módulo elástico of 5 GPa	ISO 527 \| 1 mm/min
Resistencia a la flexión	23.0 °C	130 MPa Show Supplier Material materials with Resistencia a la flexión of 130 MPa	ISO 178
Resistencia a la tracción	23.0 °C	76 MPa Show Supplier Material materials with Resistencia a la tracción of 76 MPa	ISO 527 \| break
Resistencia al choque, ensayo Izod entallado	23.0 °C	11 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 11 kJ/m²	ISO 180/1A \| 80104, 23°C
Resistencia al choque, ensayo Izod no entallado	23.0 °C	46 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 46 kJ/m²	ISO 180/1U \| unnotched 80104, 23°C

Aplicaciones térmicas

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	201 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 201 °C	ASTM D 648 \| 3.2mm, unannealed
Temperatura de flexión bajo carga	201 °C Show Supplier Material materials with Temperatura de flexión bajo carga of 201 °C

Rheological Properties

Property	Temperature	Value	Comment
Contracción	23.0 °C	0.75 % Show Supplier Material materials with Contracción of 0.75 %	ISO 294 \| 24 hrs

Technological properties

Property
Application areas	Electronic Components, Auto Aftermarket, Cluster
Availability	Europe,Americas
Processing methods	Front - Zone 3 Temperature: 260 to 270.0°C Rear - Zone 1 Temperature: 220 to 230.0°C Back Pressure: 0.2 to 0.3MPa Melt Temperature: 240 to 265.0°C Drying Time: 4hrs Middle - Zone 2 Temperature: 245 to 255.0°C Mold Temperature: 80 to 100.0°C Screw Speed: 30 to 60.0rpm Drying Temperature: 120°C Maximum Moisture Content: 0.05%
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.