General
Property | Temperature | Value | Comment |
---|---|---|---|
Densidad | 23.0 °C | 1.43 g/cm³ Show Supplier Material materials with Densidad of 1.43 g/cm³ | ISO 1183 |
Mecánica
Property | Temperature | Value | Comment |
---|---|---|---|
Elongación | 23.0 °C | 1.2 % Show Supplier Material materials with Elongación of 1.2 % | ISO 527 | yield |
Módulo de flexión | 23.0 °C | 17 GPa Show Supplier Material materials with Módulo de flexión of 17 GPa | ISO 178 |
Resistencia a la flexión | 23.0 °C | 219 MPa Show Supplier Material materials with Resistencia a la flexión of 219 MPa | ISO 178 |
Resistencia a la tracción | 23.0 °C | 158 MPa Show Supplier Material materials with Resistencia a la tracción of 158 MPa | ISO 527 | yield |
Resistencia al choque, ensayo Izod entallado | 23.0 °C | 4 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod entallado of 4 kJ/m² | ISO 180/1A | 80*10*4, 23°C |
Resistencia al choque, ensayo Izod no entallado | 23.0 °C | 30 kJ/m² Show Supplier Material materials with Resistencia al choque, ensayo Izod no entallado of 30 kJ/m² | ISO 180/1U | 80*10*4, 23°C |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Contracción | 23.0 °C | 0.23 % Show Supplier Material materials with Contracción of 0.23 % | ISO 294 | 24 hrs |
Technological properties
Property | ||
---|---|---|
Application areas | Lab Ware and Clinical Diagnostics, Semiconductor | |
Availability | Europe,Asia,Americas | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |