General
Property | Temperature | Value |
---|---|---|
Density | 23.0 °C | 8.15 g/cm³ Show Material materials with Density of 8.15 g/cm³ |
Mechanical
Property | Temperature | Value |
---|---|---|
Elastic modulus | 23.0 °C | 145 GPa Show Material materials with Elastic modulus of 145 GPa |
Elongation | 23.0 °C | 30 % Show Material materials with Elongation of 30 % |
Hardness, Vickers | 23.0 °C | 140 [-] Show Material materials with Hardness, Vickers of 140 [-] |
Tensile strength | 23.0 °C | 500 MPa Show Material materials with Tensile strength of 500 MPa |
Yield strength | 23.0 °C | 300 MPa Show Material materials with Yield strength of 300 MPa |
Thermal
Property | Temperature | Value |
---|---|---|
Coefficient of thermal expansion | 30.0 °C | 4E-6 1/K Show Material materials with Coefficient of thermal expansion of 4E-6 1/K |
450.0 °C | 7.4E-6 1/K Show Material materials with Coefficient of thermal expansion of 7.4E-6 1/K | |
Melting point | 1425 °C Show Material materials with Melting point of 1425 °C | |
Specific heat capacity | 23.0 °C | 500 J/(kg·K) Show Material materials with Specific heat capacity of 500 J/(kg·K) |
Thermal conductivity | 23.0 °C | 12.5 W/(m·K) Show Material materials with Thermal conductivity of 12.5 W/(m·K) |
Chemical properties
Technological properties
Property | ||
---|---|---|
Application areas | It can be found as a sealing material in semiconductor packages, electronic tubes, CRT electron guns, microelectronic components, thermostat rods, vacuum devices and electric industrial lamps |