EN 1652 Grade Cu-OF H110

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Description

The mark Cu-OF, mat. No CW008A, is a copper free of oxygen and deoxidation agents. To the comparable DIN-mark OFCu, mat. No 2.0040 acc. to DIN 1787 : 1973-01 applies: The material is hydrogen resistant and shows very high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferred application in electrical engineering, electronics, vacuum technology as well as for production of all types of semifinished parts when highest electrical conductivity is required. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.94 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

127 GPa

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Hardness, Vickers

20.0 °C

110 [-]

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 J/(kg·K)

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Thermal conductivity

20.0 °C

393 - 394 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.80E+7 S/m

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Electrical resistivity

20.0 °C

1.7E-8 Ω·m

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Copper

99.95 %

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Lead

5E-3 %

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