EN 1977 Grade Cu-HCP M

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Description

Cu-DHP, mat. No CW021A, is a deoxidized copper with low phosphorus-content. To the comparable DIN-mark SF-Cu, mat. No 2.0070 acc. to DIN 1787: 1973-01 (precondition for the comparability: Cu-content min. 99,95%, deoxidation agent phosphorus) applies: The material is also available in a special quality free of steam stripping elements. This is very important for vacuum technology. Tensile strength and Brinell hardness are increasable by cold forming. SE-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: good Application: Preferably application in electrical engineering, electronics. For production of all types of semifinished parts when high electrical conductivity is demanded as well as in vacuum technology and as cladding material.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

127 - 129 GPa

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.69E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.76E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 - 390 J/(kg·K)

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100.0 °C

393 J/(kg·K)

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200.0 °C

403 J/(kg·K)

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Thermal conductivity

20.0 °C

385 - 386 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.70E+7 S/m

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Electrical resistivity

20.0 °C

1.8E-8 Ω·m

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Specific Electrical conductivity

98 % IACS

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Copper

99.95 %

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Lead

5E-3 %

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Phosphorus

2E-3 - 7E-3 %

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