EN 12168 Grade CuTeP H080

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Description

CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

120 GPa

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Hardness, Brinell

20.0 °C

80 - 130 [-]

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Hardness, Vickers

20.0 °C

90 - 140 [-]

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

250 MPa

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Yield strength Rp0.2

20.0 °C

200 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

300.0 °C

1.8E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

20.0 °C

368 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.00E+7 - 5.45E+7 S/m

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Specific Electrical conductivity

86 % IACS

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Chemical properties

PropertyValue

Phosphorus

0 - 0.01 %

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Tellurium

0.4 - 0.7 %

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