OUR COOKIE DISCLAIMER
Open cookie settings
Molybdenum-copper (MoCu15) is a composite material which contains 15 percent copper by weight. This composite combines the high thermal conductivity of copper and the low thermal expansion of molybdenum.
This material data has been provided by Plansee.
Base plates for semiconductors
Components for epitaxial growth processes
Cylinders for hot isostatic pressing (HIP)
Electrodes for resistance welding made of tungsten and molybdenum
Heating elements for MOCVD
Lead replacement for X-ray shielding
Molybdenum sputtering targets
Nozzles for the production of wool and fibers
Plansee’s newly patented coating material pushing boundaries in sputtering target efficiency
Tungsten Alloy Balancing Weights
Tungsten, molybdenum and tantalum for evaporation coils
Show Supplier Material materials with Copper of 15 %
MoCu is perfect for the manufacture of passive cooling elements (heat sinks and heat spreaders) in electronic components. Due to their low weight, molybdenum-copper composites are particularly suitable for this type of application where every gram counts: In the automotive industry they are used as carrier plates for the IGBT modules that act as inverters in electric drives.
+49 89 262075200
Leopoldstraße 250 A, 80807 Munich
© 2021 Matmatch GmbH, All rights reserved.
Made with ♥ in Munich!