Molybdenum-copper (MoCu30) is a composite material which contains 30 percent copper by weight. This composite combines the high thermal conductivity of copper and the low thermal expansion of molybdenum.
9.7 g/cm³ at 20 °C
Tensile strength Rm
750 MPa at 20 °C
Yield strength Rp0.2 Rp0.2
650 MPa at 20 °C
Coefficient of thermal expansion α
7.1E-6 1/K at 22 °C
Thermal conductivity λ
205 W/(m·K) at 20 °C
Our MoCu is perfect for the manufacture of passive cooling elements (heat sinks and heat spreaders) in electronic components. Due to their low weight, molybdenum-copper composites are particularly suitable for this type of application where every gram counts: In the automotive industry they are used as carrier plates for the IGBT modules that act as inverters in electric drives.
This material data has been provided by Plansee.