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Molybdenum Copper Alloy (MoCu30)



Molybdenum-copper (MoCu30) is a composite material which contains 30 percent copper by weight. This composite combines the high thermal conductivity of copper and the low thermal expansion of molybdenum.



Density ρ

9.7 g/cm³ at 20 °C


Tensile strength Rm

750 MPa at 20 °C

Yield strength Rp0.2 Rp0.2

650 MPa at 20 °C


Coefficient of thermal expansion α

7.1E-6 1/K at 22 °C

Show chart

Thermal conductivity λ

205 W/(m·K) at 20 °C

Chemical properties


Weight %






30 %

Technological properties

Application areas

Our MoCu is perfect for the manufacture of passive cooling elements (heat sinks and heat spreaders) in electronic components. Due to their low weight, molybdenum-copper composites are particularly suitable for this type of application where every gram counts: In the automotive industry they are used as carrier plates for the IGBT modules that act as inverters in electric drives.

This material data has been provided by Plansee.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.