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CMC (Cu-Mo-Cu) laminates are ideal to meet the thermal requirements in the field of high-frequency electronics. The structure and thickness of the copper and molybdenum layers can be varied, allowing the coefficient of thermal expansion to be perfectly matched to common semiconductor materials and achieving high levels of thermal conductivity.
9.3 g/cm³ at 20 °C
Coefficient of thermal expansion α
6.5E-6 1/K at 150 °C
Thermal conductivity λ
220 - 305 W/(m·K) at 20 °C
in z-direction and xy-direction respectively
This material data has been provided by Plansee.