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Cu/Mo/Cu Laminate (CMC)



CMC (Cu-Mo-Cu) laminates are ideal to meet the thermal requirements in the field of high-frequency electronics. The structure and thickness of the copper and molybdenum layers can be varied, allowing the coefficient of thermal expansion to be perfectly matched to common semiconductor materials and achieving high levels of thermal conductivity.



Density ρ

9.3 g/cm³ at 20 °C


Coefficient of thermal expansion α

6.5E-6 1/K at 150 °C

Show chart

Thermal conductivity λ

220 - 305 W/(m·K) at 20 °C

in z-direction and xy-direction respectively

This material data has been provided by Plansee.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.