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Material Supplied by

Plansee

Cu/Mo/Cu Laminate (CMC)

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Description

CMC (Cu-Mo-Cu) laminates are ideal to meet the thermal requirements in the field of high-frequency electronics. The structure and thickness of the copper and molybdenum layers can be varied, allowing the coefficient of thermal expansion to be perfectly matched to common semiconductor materials and achieving high levels of thermal conductivity.

Properties

General

Density ρ

9.3 g/cm³ at 20 °C

Thermal

Coefficient of thermal expansion α

6.5E-6 1/K at 150 °C

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Thermal conductivity λ

220 - 305 W/(m·K) at 20 °C

in z-direction and xy-direction respectively

This material data has been provided by Plansee.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.