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CMC (Cu-Mo-Cu) laminates are ideal to meet the thermal requirements in the field of high-frequency electronics. The structure and thickness of the copper and molybdenum layers can be varied, allowing the coefficient of thermal expansion to be perfectly matched to common semiconductor materials and achieving high levels of thermal conductivity.
This material data has been provided by Plansee.
Base plates for semiconductors
Components for epitaxial growth processes
Cylinders for hot isostatic pressing (HIP)
Electrodes for resistance welding made of tungsten and molybdenum
Heating elements for MOCVD
Lead replacement for X-ray shielding
Molybdenum sputtering targets
Nozzles for the production of wool and fibers
Plansee’s newly patented coating material pushing boundaries in sputtering target efficiency
Tungsten Alloy Balancing Weights
Tungsten, molybdenum and tantalum for evaporation coils
Show Supplier Material materials with Density of 9.3 g/cm³
Coefficient of thermal expansion
Show Supplier Material materials with Coefficient of thermal expansion of 6.5E-6 1/K
6.5E-6 - 6.6E-6 1/K
Show Supplier Material materials with Coefficient of thermal expansion of 6.5E-6 - 6.6E-6 1/K
220 - 305 W/(m·K)
Show Supplier Material materials with Thermal conductivity of 220 - 305 W/(m·K)
in z-direction and xy-direction respectively
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