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Cu/Mo-30Cu/Cu Laminate (PMC®)

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Description

PMC laminates combine excellent heat spreading needs with low thermal expansion. PMC is a 3-layer composite with a MoCu core plated with pure OF copper. This laminate is usually structured with a thickness ratio between layers of 1:4:1.

Properties

General

Density ρ

9.4 - 9.6 g/cm³ at 20 °C

Thermal

Coefficient of thermal expansion α

7E-6 - 8E-6 1/K at 150 °C

Show chart

Thermal conductivity λ

170 - 280 W/(m·K) at 20 °C

in z-direction and xy-direction respectively

Technological properties

Application areas

Excellent heat distribution and dissipation makes PMC® suitable for LDMOS transistors and other applications with particularly high power densities.

This material data has been provided by Plansee.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.