PMC laminates combine excellent heat spreading needs with low thermal expansion. PMC is a 3-layer composite with a MoCu core plated with pure OF copper. This laminate is usually structured with a thickness ratio between layers of 1:4:1.
9.4 - 9.6 g/cm³ at 20 °C
Coefficient of thermal expansion α
7E-6 - 8E-6 1/K at 150 °C
Thermal conductivity λ
170 - 280 W/(m·K) at 20 °C
in z-direction and xy-direction respectively
Excellent heat distribution and dissipation makes PMC® suitable for LDMOS transistors and other applications with particularly high power densities.
This material data has been provided by Plansee.