Cu/Mo/Cu/.../Cu Laminate (S-CMC)

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Description

S-CMC (Cu-Mo-Cu-…-Cu) laminates are ideal to meet the thermal requirements in the field of high-frequency electronics. The structure and thickness of the copper and molybdenum layers can be varied, allowing the coefficient of thermal expansion to be perfectly matched to common semiconductor materials and achieving high levels of thermal conductivity.

This material data has been provided by Plansee.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValue

Density

23.0 °C

9.2 g/cm³

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

150.0 °C

8.1E-6 1/K

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800.0 °C

7.5E-6 1/K

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Thermal conductivity

23.0 °C

250 - 350 W/(m·K)

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in z-direction and xy-direction respectively

Technological properties

Property