Transparent, Thermoplastic Polyimide (TPI) resin with a glass transition temperature (Tg) of 247C. This product has thinwall FR capability and has a UL94 V0 listing. This material is RoHS compliant and also halogen free according VDE/DIN 472 part 815. Resin is subject to U.S. Commerce Control Laws (15CFR Chapter VII, Part 774).
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Density
ρ1.3 g/cm³ at 23 °C
ISO 1183
Limiting oxygen index
LOI45 % at 23 °C
Moisture absorption
cmoisture0.6 % at 23 °C
ISO 62 | (23°C / 50% RH)
Relative density
ρrel1.3 [-] at 23 °C
ASTM D 792
Water absorption
cwater1.75 % at 23 °C
ISO 62-1 | (23°C/saturated)
Impact strength, Charpy unnotched Iunnot
ISO 179/1eU | Unnotch Edgew 80*10*4 sp=62mm, -30°C
Impact strength, Izod unnotched IIzod,unnot
ISO 180/1U | unnotched 80*10*4, -30°C
Impact strength, Izod unnotched, ASTM IIzod,unnot,astm
ASTM D 4812 | 23°C
Ball Pressure Test
Passes
Coefficient of thermal expansion
α5E-5 1/K at 23 °C
ISO 11359-2 | 23°C to 150°C
Coefficient of thermal expansion, transverse
αtrans5E-5 1/K at 23 °C
ISO 11359-2 | 23°C to 150°C
Flammability
UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=257957 | UL Recognized, 94V-0 Flame Class Rating: 0.75 mm UL 94 | Glow Wire Flammability Index 960°C, passes at: 3.2 mm IEC 60695-2-12 | Glow Wire Flammability Index 960°C, passes at: 3.2 mm IEC 60695-2-12
Glow Wire Ignition Temperature
GWIT850 °C
IEC 60695-2-13 | 3.0 mm
Heat deflection temperature, 0.45 MPa
HDT0.45,MPa237 °C
ASTM D 648 | 6.4 mm, unannealed
Heat deflection temperature, 1.80 MPa
HDT1.8,MPa228 °C
ISO 75/Af | Flatw 80*10*4 sp=64mm
Relative temperature index, electrical
RTIel160 °C
UL 746B
Relative temperature index, mechanical impact
RTIimp120 °C
UL 746B
Relative temperature index, mechanical strength
RTIstr160 °C
UL 746B
Thermal conductivity
λ0.22 W/(m·K) at 23 °C
ASTM E 1530 |
Vicat softening temperature
Tsoft242 °C
ISO 306 | Rate B/50
Comparative tracking index
CTI3 V at 23 °C
UL 746A | (UL) {PLC}
Dielectric constant, 100Hz
εr,100Hz3.41 [-] at 23 °C
ASTM D 150
Dielectric strength
EDS17 kV/mm at 23 °C
ASTM D 149 | in oil, 3.2 mm
Dissipation factor, 100Hz
ε''100Hz8E-3 [-] at 23 °C
IEC 60250
Dissipation factor, 1MHz
ε''1MHz7E-3 [-] at 23 °C
IEC 60250
Dissipation factor, 1kHz
ε''1KHz1E-3 [-] at 23 °C
IEC 60250
Dissipation factor, 50Hz
ε''50Hz0.03 [-] at 23 °C
IEC 60250 | 50/60 Hz
High Amp Arc Ignition
HAI0.75 mm at 23 °C
UL 746A | PLC 4
Hot-Wire Ignition
HWI3 mm at 23 °C
UL 746A | PLC 1
Haze
H2 %
ASTM D 1003 | 2.54 mm
Transmission
t58 %
ASTM D 1003 | 2.54 mm
Melt mass-flow rate
MFR15.5 g/10min
ASTM D 1238 | 367°C/6.6 kgf
Melt volume-flow rate
MVR8 cm³/10min
ISO 1133 | MVR at 360°C/5.0 kg
Shrinkage
cshrink0.5 % at 23 °C
SABIC method | 3.2 mm
Shrinkage, transverse
cshrink, trans0.5 % at 23 °C
SABIC method | 3.2 mm
Application areas
Electronic Components, Personal Computing, Meter Gas
Availability
Europe,Asia,Americas
Features
High Heat Resistance
Processing methods
Drying Temperature: 150 °C | Drying Time: 4 to 6.0 hrs | Drying Time (Cumulative): 24 hrs | Maximum Moisture Content: 0.02 % | Melt Temperature: 380 to 405.0 °C | Nozzle Temperature: 375 to 400.0 °C | Front - Zone 3 Temperature: 380 to 405.0 °C | Middle - Zone 2 Temperature: 370 to 395.0 °C | Rear - Zone 1 Temperature: 360 to 380.0 °C | Mold Temperature: 140 to 180.0 °C | Shot to Cylinder Size: 40 to 60.0 % | Vent Depth: 0.025 to 0.076 mm | Intake (throat) temperature: 70 to 100.0 °C | Back pressure (Plastic Pressure): 5 to 10.0 MPa | Screw speed (Circumferential speed): 0.2 m/s
Supplier Disclaimer
While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.
This material data has been provided by Sabic.