Cu-DHP (SF-Cu) Copper Hard

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Description

Oxygen free copper grade

Equivalent Materials

This material data has been provided by Salomons Metalen.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValue

Elastic modulus

23.0 °C

128 GPa

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Elongation A5

23.0 °C

6 %

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Hardness, Brinell

23.0 °C

102 [-]

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Tensile strength

23.0 °C

420 MPa

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Yield strength Rp0.2

23.0 °C

320 MPa

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Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

23.0 °C

1.76E-5 1/K

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Thermal conductivity

23.0 °C

330 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

4.50E+7 S/m

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Chemical properties

PropertyValue

Copper

99.9 %

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Phosphorus

0.02 - 0.04 %

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