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Cu-DHP (SF-Cu) Copper

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Description

Oxygen free copper grade

Equivalent Materials

Properties

Electrical

Electrical conductivity σel

4.50E+7 S/m at 20 °C

General

Density ρ

8.9 g/cm³ at 20 °C

Mechanical

Elastic modulus E

128 GPa at 20 °C

Elongation A

6 - 42 % at 20 °C

hard - soft

Hardness, Brinell HB

40 - 105 [-] at 20 °C

Tensile strength Rm

200 - 420 MPa at 20 °C

Yield strength YS

50 - 320 MPa at 20 °C

Thermal

Coefficient of thermal expansion α

1.76E-5 1/K at 20 °C

Thermal conductivity λ

330 W/(m·K) at 20 °C

This material data has been provided by Salomons Metalen.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.