Description

Oxygen free copper grade

Equivalent Materials

Properties

General

Density ρ

8.9 g/cm³ at 20 °C

Mechanical

Elastic modulus E

128 GPa at 20 °C

Elongation A5 A5

6 % at 20 °C

Hardness, Brinell HB

102 [-] at 20 °C

Tensile strength Rm

420 MPa at 20 °C

Yield strength Rp0.2 Rp0.2

320 MPa at 20 °C

Thermal

Coefficient of thermal expansion α

1.76E-5 1/K at 20 °C

Thermal conductivity λ

330 W/(m·K) at 20 °C

Electrical

Electrical conductivity σel

4.50E+7 S/m at 20 °C

Chemical properties

Element

Weight %

Comment

Cu

99.9 %

P

0.02 - 0.04 %

This material data has been provided by Salomons Metalen.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.