General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.04 g/cm³ Show Supplier Material materials with Density of 1.04 g/cm³ | ASTM D792 |
Water absorption | 23.0 °C | 0.07 % Show Supplier Material materials with Water absorption of 0.07 % | ASTM D570 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elongation | 23.0 °C | 45 % Show Supplier Material materials with Elongation of 45 % | ASTM D638 |
Flexural modulus | 23.0 °C | 2.26 GPa Show Supplier Material materials with Flexural modulus of 2.26 GPa | ASTM D790 |
Hardness, Rockwell R | 23.0 °C | 99 [-] Show Supplier Material materials with Hardness, Rockwell R of 99 [-] | ASTM D785 |
Impact strength, Izod unnotched | 23.0 °C | 11.5 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 11.5 kJ/m² | ISO 180 |
Yield strength | 23.0 °C | 45 MPa Show Supplier Material materials with Yield strength of 45 MPa | ASTM D638 |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 9.05E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 9.05E-5 1/K | ASTM D696 |
Heat deflection temperature, 1.80 MPa | 80 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 80 °C | ASTM D648 | |
Vicat softening temperature | 80 °C Show Supplier Material materials with Vicat softening temperature of 80 °C | ASTM D1525 |
Electrical
Property | Temperature | Value | Comment |
---|---|---|---|
Dielectric strength | 23.0 °C | 150 kV/mm Show Supplier Material materials with Dielectric strength of 150 kV/mm | ASTM D149 |
Surface resistivity | 23.0 °C | 1.00E+13 Ω/sq Show Supplier Material materials with Surface resistivity of 1.00E+13 Ω/sq | IEC 93 |
Rheological Properties
Property | Value | Comment |
---|---|---|
Melt mass-flow rate | 3 g/10min Show Supplier Material materials with Melt mass-flow rate of 3 g/10min | ASTM D1238 |
Technological properties
Property | ||
---|---|---|
Application areas | SHEET FOR THERMOFORMING, FOOD PACKAGING, ELECTRONIC PACKAGING |