HIPS 3341

Alternative and trade names
3341, PS-I
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Description

TPSC, Polystyrene Impact 3341 is a high ductility polystyrene for extrusion application. It offers good mechanical and thermal properties, that leads to manufacturing of thermoformed articles with good rigidity and toughness.

This material data has been provided by Toling Corporation Sdn Bhd .

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.04 g/cm³

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ASTM D792

Water absorption

23.0 °C

0.07 %

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ASTM D570

Mechanical

PropertyTemperatureValueComment

Elongation

23.0 °C

45 %

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ASTM D638

Flexural modulus

23.0 °C

2.26 GPa

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ASTM D790

Hardness, Rockwell R

23.0 °C

99 [-]

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ASTM D785

Impact strength, Izod unnotched

23.0 °C

11.5 kJ/m²

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ISO 180

Yield strength

23.0 °C

45 MPa

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ASTM D638

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

9.05E-5 1/K

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ASTM D696

Heat deflection temperature, 1.80 MPa

80 °C

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ASTM D648

Vicat softening temperature

80 °C

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ASTM D1525

Electrical

PropertyTemperatureValueComment

Dielectric strength

23.0 °C

150 kV/mm

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ASTM D149

Surface resistivity

23.0 °C

1.00E+13 Ω/sq

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IEC 93

Rheological Properties

PropertyValueComment

Melt mass-flow rate

3 g/10min

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ASTM D1238

Technological properties

Property
Application areas

SHEET FOR THERMOFORMING, FOOD PACKAGING, ELECTRONIC PACKAGING