Allgemein
| Property | Temperature | Value | Comment |
|---|---|---|---|
Dichte | 23.0 °C | 1.42 g/cm³ Show Material materials with Dichte of 1.42 g/cm³ | ASTM D 792 |
Wasserabsorption | 23.0 °C | 0.07 % Show Material materials with Wasserabsorption of 0.07 % | ASTM D 570 | 24 Hours |
Mechanisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Biegefestigkeit | 23.0 °C | 128 MPa Show Material materials with Biegefestigkeit of 128 MPa | ASTM D 790 |
Biegemodul | 23.0 °C | 6.08 GPa Show Material materials with Biegemodul of 6.08 GPa | ASTM D 790 |
Dehnung | 23.0 °C | 5 % Show Material materials with Dehnung of 5 % | SABIC - Japan Method |
Impact strength, Izod notched, ASTM | 23.0 °C | 137 J/m Show Material materials with Impact strength, Izod notched, ASTM of 137 J/m | ASTM D 256 |
Streckgrenze | 23.0 °C | 96 MPa Show Material materials with Streckgrenze of 96 MPa | SABIC - Japan Method |
Thermisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Heat deflection temperature, 1.80 MPa | 205 °C Show Material materials with Heat deflection temperature, 1.80 MPa of 205 °C | ASTM D 648 | 1.82 MPa, 3.2mm, unannealed | |
Koeffizient der thermischen Ausdehnung | 23.0 °C | 3E-5 1/K Show Material materials with Koeffizient der thermischen Ausdehnung of 3E-5 1/K | TMA | -30°C to 30°C |
Elektrisch
| Property | Temperature | Value | Comment |
|---|---|---|---|
Dielektrizitätskonstante | 23.0 °C | 3 [-] Show Material materials with Dielektrizitätskonstante of 3 [-] | ASTM D 150 | at 50/60 Hz |
Volume resistivity | 23.0 °C | 1.00E+18 Ω·cm Show Material materials with Volume resistivity of 1.00E+18 Ω·cm | ASTM D 257 |
Rheological Properties
| Property | Temperature | Value | Comment |
|---|---|---|---|
Schrumpfung | 23.0 °C | 0.6 - 0.8 % Show Material materials with Schrumpfung of 0.6 - 0.8 % | SABIC method | 6.4 mm |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Auto Aftermarket,Data Transfer,Electronic Components,Enclosures,EV Infrastructure | |
| Fillers | 30% Glass Fiber | |