Zytel® HTN55G55TLW BK117

Alternative und Handelsbezeichungen
PA-I-GF55

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN55G55TLW BK117 is a 55% glass reinforced high performance polyamide resinwith improved toughness and low warpage, developed for structural applications where good flow is needed in thin sections. It is also a PPA resin.

Diese Materialdaten wurden von Matmatch zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
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Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.66 g/cm³ Show Material materials with Dichte of 1.66 g/cm³	ISO 1183

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	360 MPa Show Material materials with Biegefestigkeit of 360 MPa	ISO 178
Biegemodul	23.0 °C	17 GPa Show Material materials with Biegemodul of 17 GPa	ISO 178
Dehnung	23.0 °C	1.8 % Show Material materials with Dehnung of 1.8 %	ISO 527-1/-2
Elastizitätsmodul	23.0 °C	18.7 GPa Show Material materials with Elastizitätsmodul of 18.7 GPa	ISO 527-1/-2
Poissonzahl	23.0 °C	0.33 [-] Show Material materials with Poissonzahl of 0.33 [-]
Schlagfestigkeit, Charpy gekerbt	-40.0 °C	20 kJ/m² Show Material materials with Schlagfestigkeit, Charpy gekerbt of 20 kJ/m²	ISO 179/1eA
	23.0 °C	18 kJ/m² Show Material materials with Schlagfestigkeit, Charpy gekerbt of 18 kJ/m²	ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt	23.0 °C	75 kJ/m² Show Material materials with Schlagzähigkeit, Charpy ungekerbt of 75 kJ/m²	ISO 179/1eU
Zugfestigkeit	23.0 °C	243 MPa Show Material materials with Zugfestigkeit of 243 MPa	ISO 527-1/-2

Thermisch

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	236 °C Show Material materials with Heat deflection temperature, 1.80 MPa of 236 °C	ISO 75-1/-2
Schmelzpunkt	296 °C Show Material materials with Schmelzpunkt of 296 °C	ISO 11357-1/-3 \| first heat
Entflammbarkeit	Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Glow Wire Flammability Index, 30mil: 725 °C, Glow Wire Flammability Index, 60mil: 725 °C, Glow Wire Flammability Index, 120mil: 960 °C, Glow Wire Ignition Temperature, 30mil: 750 °C, Glow Wire Ignition Temperature, 60mil: 750 °C, Glow Wire Ignition Temperature, 120mil: 850 °C

Elektrisch

Property	Temperature	Value	Comment
Kriechstromfestigkeit	23.0 °C	600 V Show Material materials with Kriechstromfestigkeit of 600 V	IEC 60112

Technological properties

Property
Fillers	55% Glass Fiber
Processing methods	Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Min. melt temperature: 300°C, Max. melt temperature: 315°C, Min. mold temperature: 70°C, Max. mold temperature: 130°C

Zytel® HTN55G55TLW BK117

Description

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