Zytel® HTN53G50HSLR BK083

Alternative und Handelsbezeichungen
PA-GF50
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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN53G50HSLR BK083 is a 50% glass reinforced, heat stabilized, lubricated high performance polyamide resin developed for moderate temperature structural applications requiring retention of high impact and stiffness.

Equivalent Materials

Diese Materialdaten wurden von Matmatch zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.59 g/cm³

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ISO 1183

Mechanisch

PropertyTemperatureValueComment

Biegefestigkeit

23.0 °C

390 MPa

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ISO 178

Biegemodul

23.0 °C

15 GPa

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ISO 178

Dehnung

23.0 °C

2.8 %

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ISO 527-1/-2

Elastizitätsmodul

23.0 °C

16 GPa

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ISO 527-1/-2

Poissonzahl

23.0 °C

0.33 [-]

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Schlagfestigkeit, Charpy gekerbt

-6.0 °C

13 kJ/m²

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ISO 179/1eA

23.0 °C

14 kJ/m²

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ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt

-6.0 °C

65 kJ/m²

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ISO 179/1eU

23.0 °C

95 kJ/m²

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ISO 179/1eU

Unlock all property charts

Schlagzähigkeit, Izod ungekerbt

23.0 °C

13 kJ/m²

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ISO 180/1A

Zugfestigkeit

23.0 °C

250 MPa

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ISO 527-1/-2

Thermisch

PropertyTemperatureValueComment

Glasübergangstemperatur

85 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

254 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

234 °C

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ISO 75-1/-2

Koeffizient der thermischen Ausdehnung

23.0 °C

1.9E-5 1/K

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ISO 11359-1/-2 | -40 - 23°C

Relative temperature index, electrical

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

65 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

65 °C

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UL 746B | 120mil

Schmelzpunkt

260 °C

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ISO 11357-1/-3 | first heat

thermischer Ausdehnungskoeffizient, transversal

23.0 °C

9.5E-5 1/K

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ISO 11359-1/-2 | 55 - 160°C

Entflammbarkeit

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 27 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Elektrisch

PropertyTemperatureValueComment

Kriechstromfestigkeit

23.0 °C

550 V

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IEC 60112

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.2 %

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ISO 294-4, 2577

Schrumpfung, diagonal

23.0 °C

0.5 %

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ISO 294-4, 2577

Technological properties

Property
Fillers

50% Glass Fiber

Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 290°C, Min. melt temperature: 280°C, Max. melt temperature: 300°C, Min. mold temperature: 90°C, Max. mold temperature: 110°C