Zytel® HTN55G55TLW BK773

Alternative und Handelsbezeichungen
PA-I-GF55

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Description

Zytel® HTN high performance polyamide resins feature high retention of properties upon exposure to elevated temperature, to high moisture, and to harsh chemical environments. Polymer families and grades of Zytel® HTN are tailored to optimize performance as well as processability. Typical applications with Zytel® HTN include demanding applications in the automotive, electrical and electronics, domestic appliances, and construction industries. Zytel® HTN55G55TLW BK773 is a 55% glass reinforced high performance polyamide resinwith improved toughness and low warpage, developed for structural applications where good flow is needed in thin sections. It is also a PPA resin.

Equivalent Materials

Diese Materialdaten wurden von Matmatch zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

Property	Temperature	Value	Comment
Dichte	23.0 °C	1.68 g/cm³ Show Material materials with Dichte of 1.68 g/cm³	ISO 1183

Mechanisch

Property	Temperature	Value	Comment
Biegefestigkeit	23.0 °C	380 MPa Show Material materials with Biegefestigkeit of 380 MPa	ISO 178
Biegemodul	23.0 °C	17.9 GPa Show Material materials with Biegemodul of 17.9 GPa	ISO 178
Dehnung	23.0 °C	1.8 % Show Material materials with Dehnung of 1.8 %	ISO 527-1/-2
Elastizitätsmodul	23.0 °C	21 GPa Show Material materials with Elastizitätsmodul of 21 GPa	ISO 527-1/-2
Poissonzahl	23.0 °C	0.33 [-] Show Material materials with Poissonzahl of 0.33 [-]
Schlagfestigkeit, Charpy gekerbt	-6.0 °C	25 kJ/m² Show Material materials with Schlagfestigkeit, Charpy gekerbt of 25 kJ/m²	ISO 179/1eA
	23.0 °C	21 kJ/m² Show Material materials with Schlagfestigkeit, Charpy gekerbt of 21 kJ/m²	ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt	-6.0 °C	60 kJ/m² Show Material materials with Schlagzähigkeit, Charpy ungekerbt of 60 kJ/m²	ISO 179/1eU
	23.0 °C	80 kJ/m² Show Material materials with Schlagzähigkeit, Charpy ungekerbt of 80 kJ/m²	ISO 179/1eU
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Zugfestigkeit	23.0 °C	260 MPa Show Material materials with Zugfestigkeit of 260 MPa	ISO 527-1/-2

Thermisch

Property	Value	Comment
Heat deflection temperature, 1.80 MPa	244 °C Show Material materials with Heat deflection temperature, 1.80 MPa of 244 °C	ISO 75-1/-2
Schmelzpunkt	296 °C Show Material materials with Schmelzpunkt of 296 °C	ISO 11357-1/-3 \| first heat
Entflammbarkeit	Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Glow Wire Flammability Index, 30mil: 725 °C, Glow Wire Flammability Index, 60mil: 725 °C, Glow Wire Flammability Index, 120mil: 960 °C, Glow Wire Ignition Temperature, 30mil: 750 °C, Glow Wire Ignition Temperature, 60mil: 750 °C, Glow Wire Ignition Temperature, 120mil: 850 °C, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Rheological Properties

Property	Temperature	Value	Comment
Schrumpfung	23.0 °C	0.1 % Show Material materials with Schrumpfung of 0.1 %	ISO 294-4, 2577
Schrumpfung, diagonal	23.0 °C	0.2 % Show Material materials with Schrumpfung, diagonal of 0.2 %	ISO 294-4, 2577

Technological properties

Property
Fillers	55% Glass Fiber
Processing methods	Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Min. melt temperature: 300°C, Max. melt temperature: 315°C, Min. mold temperature: 70°C, Max. mold temperature: 130°C

Zytel® HTN55G55TLW BK773

Description

Equivalent Materials

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