Zytel® HTN51G15HSL BK083

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Description

Zytel® HTN51G15HSL BK083 is a 15% glass reinforced, heat stabilized, lubricated, hydrolysis resistant high performance polyamide resin. It is also a PPA resin.

Equivalent Materials

Diese Materialdaten wurden von Matmatch zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyTemperatureValueComment

Dichte

23.0 °C

1.3 g/cm³

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ISO 1183

Mechanisch

PropertyTemperatureValueComment

Biegemodul

23.0 °C

5.8 GPa

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ISO 178

Dehnung

23.0 °C

2 %

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ISO 527-1/-2

Elastizitätsmodul

23.0 °C

6.5 GPa

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ISO 527-1/-2

Poissonzahl

23.0 °C

0.35 [-]

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Schlagfestigkeit, Charpy gekerbt

-40.0 °C

5 kJ/m²

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ISO 179/1eA

23.0 °C

5 kJ/m²

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ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt

23.0 °C

23 kJ/m²

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ISO 179/1eU

Schlagzähigkeit, Izod ungekerbt

-40.0 °C

5 kJ/m²

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ISO 180/1A

23.0 °C

5 kJ/m²

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ISO 180/1A

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Zugfestigkeit

23.0 °C

110 MPa

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ISO 527-1/-2

Thermisch

PropertyValueComment

Glasübergangstemperatur

135 °C

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ISO 11357-1/-2 | 18°F/min

Heat deflection temperature, 0.45 MPa

276 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

250 °C

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ISO 75-1/-2

Relative temperature index, electrical

150 °C

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UL 746B | 120mil

Relative temperature index, mechanical impact

130 °C

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UL 746B | 120mil

Relative temperature index, mechanical strength

150 °C

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UL 746B | 120mil

Schmelzpunkt

300 °C

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ISO 11357-1/-3 | first heat

Entflammbarkeit

Burning Behav. at 60mil nom. thickn.: HB class, Thickness tested: 1.5 mm, UL recognition: yes -, Burning Behav. at thickness h: HB class, Thickness tested: 0.75 mm, UL recognition: yes -, Oxygen index: 23 %, FMVSS Class: B -, Burning rate, Thickness 1 mm: <80 mm/min

Elektrisch

PropertyTemperatureValueComment

Dielektrizitätskonstante, 1 MHz

23.0 °C

3.7 [-]

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IEC 62631-2-1

Dissipation factor, 1MHz

23.0 °C

0.02 [-]

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IEC 62631-2-1

Kriechstromfestigkeit

23.0 °C

575 V

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IEC 60112

Volume resistivity

23.0 °C

1.00E+15 Ω·cm

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IEC 62631-3-1

Rheological Properties

PropertyTemperatureValueComment

Schrumpfung

23.0 °C

0.3 %

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ISO 294-4, 2577

Schrumpfung, diagonal

23.0 °C

0.6 %

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ISO 294-4, 2577

Technological properties

Property
Processing methods

Drying Recommended: yes, Drying Temperature: 100°C, Drying Time, Dehumidified Dryer: 6-8h, Processing Moisture Content: ≤0.1%, Melt Temperature Optimum: 325°C, Min. melt temperature: 320°C, Max. melt temperature: 330°C, Mold Temperature Optimum: 150°C, Min. mold temperature: 140°C, Max. mold temperature: 180°C