EN 1652 Grade Cu-OF H110

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Description

The mark Cu-OF, mat. No CW008A, is a copper free of oxygen and deoxidation agents. To the comparable DIN-mark OFCu, mat. No 2.0040 acc. to DIN 1787 : 1973-01 applies: The material is hydrogen resistant and shows very high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferred application in electrical engineering, electronics, vacuum technology as well as for production of all types of semifinished parts when highest electrical conductivity is required. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

Diese Materialdaten wurden von WIAM zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Properties of Copper

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Eigenschaften

Allgemein

Property	Temperature	Value
Dichte	20.0 °C	8.94 g/cm³ Show Material materials with Dichte of 8.94 g/cm³

Mechanisch

Property	Temperature	Value	Comment
Elastizitätsmodul	20.0 °C	127 GPa Show Material materials with Elastizitätsmodul of 127 GPa
Härte, Vickers	20.0 °C	110 [-] Show Material materials with Härte, Vickers of 110 [-]
Poissonzahl	20.0 °C	0.34 [-] Show Material materials with Poissonzahl of 0.34 [-]
Schubmodule	23.0 °C	48 GPa Show Material materials with Schubmodule of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper

Thermisch

Property	Temperature	Value	Comment
Koeffizient der thermischen Ausdehnung	23.0 °C	1.6E-5 - 1.8E-5 1/K Show Material materials with Koeffizient der thermischen Ausdehnung of 1.6E-5 - 1.8E-5 1/K	Typical for Wrought Copper Pure / Low Alloyed Copper
Schmelzpunkt		965 - 1100 °C Show Material materials with Schmelzpunkt of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper
Spezifische Wärmekapazität	20.0 °C	385 J/(kg·K) Show Material materials with Spezifische Wärmekapazität of 385 J/(kg·K)
Wärmeleitfähigkeit	20.0 °C	393 - 394 W/(m·K) Show Material materials with Wärmeleitfähigkeit of 393 - 394 W/(m·K)

Elektrisch

Property	Temperature	Value
Elektrische Leitfähigkeit	20.0 °C	5.80E+7 S/m Show Material materials with Elektrische Leitfähigkeit of 5.80E+7 S/m
spezifischer Widerstand	20.0 °C	1.7E-8 Ω·m Show Material materials with spezifischer Widerstand of 1.7E-8 Ω·m

Chemical properties

Property	Value
Bismut	5E-4 % Show Material materials with Bismut of 5E-4 %
Blei	5E-3 % Show Material materials with Blei of 5E-3 %
Kupfer	99.95 % Show Material materials with Kupfer of 99.95 %

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